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DIM200PLM33-F000 Abstract: DIM200PLM33-F IGBT 1000V .200A application note Contextual Info: DIM200PLM33-F000 IGBT Chopper Module Replaces DS5864-2 DS5864-3 October 2011 LN28812 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	DIM200PLM33-F000 DS5864-2 DS5864-3 LN28812) DIM200PLM33-F000 DIM200PLM33-F IGBT 1000V .200A application note	PDF
Contextual Info: DIM200PLM33-F000 IGBT Chopper Module Replaces DS5864-2 DS5864-3 October 2011 LN28812 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)	Original	DIM200PLM33-F000 DS5864-2 DS5864-3 LN28812)	PDF

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DIM200PLM33-F000

Abstract: DIM200PLM33-F IGBT 1000V .200A application note
Contextual Info: DIM200PLM33-F000 IGBT Chopper Module Replaces DS5864-2 DS5864-3 October 2011 LN28812 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

Original

DIM200PLM33-F000 DS5864-2 DS5864-3 LN28812) DIM200PLM33-F000 DIM200PLM33-F IGBT 1000V .200A application note

PDF

Contextual Info: DIM200PLM33-F000 IGBT Chopper Module Replaces DS5864-2 DS5864-3 October 2011 LN28812 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)

Original

DIM200PLM33-F000 DS5864-2 DS5864-3 LN28812)

PDF