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TLP291-4
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (phototransistor output), DC input, 2500 Vrms, 4 channel, SO16 |
Datasheet
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75844-129-14LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10129382-914003BLF
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Amphenol Communications Solutions
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EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 3.05mm (0.12inch) Tail |
PDF
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10129382-914004BLF
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Amphenol Communications Solutions
|
EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 2.29mm (0.09inch) Tail |
PDF
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10114829-14105LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 5 Positions |
PDF
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