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TLP2304
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 3750 Vrms, 5pin SO6 |
Datasheet
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|
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TLP2719
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 5000 Vrms, SO6L |
Datasheet
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|
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87606-310HLF
|
|
Amphenol Communications Solutions
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Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 20 Positions, 2.54mm (0.100in) Pitch |
PDF
|
|
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51763-10300000AALF
|
|
Amphenol Communications Solutions
|
PwrBlade®, Power Connectors, 3P Right Angle Receptacle, Solder To Board |
PDF
|
|
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94063-105HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
PDF
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