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Infineon Technologies AG
IDC08D120T6MX1SA2 DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IDC08D120T6MX1SA2)
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Avnet IDC08D120T6MX1SA2 Waffle Pack 0 42 Weeks 491 - - - $0.6819 $0.6479 Buy Now

IDC08D120T6M datasheet (1)

Part Manufacturer Description Type PDF
IDC08D120T6M Infineon Technologies Chip Diodes; Package: --; Technology: Emitter Controlled Diode 4 Medium Power; V<sub>DS</sub> (max): 1,200.0 V; I<sub>F </sub> (max): 10.0 A; I<sub>F,SM</sub> (max): -; V<sub>F</sub> (typ): 1.7 V Original PDF

IDC08D120T6M Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - IDC08D120T6M

Abstract: L4667B
Text: IDC08D120T6M Diode EMCON 4 Medium Power Chip FEATURES: · 1200V EMCON 4 technology · soft, fast , Die Size Package IDC08D120T6M 1200V 10A 2.20 x 3.41 mm2 sawn on foil MECHANICAL , °C Edited by INFINEON Technologies, AIM PMD D CID T, L4667B, Edition 0.9, 26.06.07 IDC08D120T6M Maximum , INFINEON Technologies, AIM PMD D CID T, L4667B, Edition 0.9, 26.06.07 IDC08D120T6M CHIP DRAWING: Edited by INFINEON Technologies, AIM PMD D CID T, L4667B, Edition 0.9, 26.06.07 IDC08D120T6M FURTHER


Original
PDF IDC08D120T6M L4667B, IDC08D120T6M L4667B
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