Not Available
Abstract: No abstract text available
Text: SAB9 includes support for most NXP LPC9xx devices in the following packages: TSSOP, HVSON10 , HQVFN28 , mount parts such as the HVSON10 and HQVFN28. All signals from every socket (except PLC44) are brought , like HVSON10 & HQVFN28 ⢠On board LED for testing Technical Details SAB9 Supported Devices , P89LPC93xFDH P89LPC9107FDH P89LPC9102FTK HVSON10 P89LPC9103FTK P89V52xxA PLCC44 USB-ICP-SAB9 shown
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HVSON10,
HQVFN28,
DIP28.
HVSON10
HQVFN28.
PLC44)
14-pin,
P89LPC93xFHN
HQVFN28
P89LPC92xFN
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2013 - Not Available
Abstract: No abstract text available
Text: HV S ON 10 SOT650-1 HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 Rev. 2 â 18 April 2013 Packing , ) 330 x 12 6000 1 341 x 338 x 26 SOT650-1 NXP Semiconductors HVSON10 ; Reel pack; SMD , -1 NXP Semiconductors HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part , . 3 of 4 SOT650-1 NXP Semiconductors HVSON10 ; Reel pack; SMD, 13" Q1/T1 Standard product
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OT650-1
HVSON10;
001aak603
OT650-1
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USB-ICP-SAB9
Abstract: HVSON10 PLC44 PLCC44 socket P89LPC9102FTK P89LPC9103FTK P89LPC9107FDH PLCC44 80C51 DIP28
Text: SAB9 includes support for most NXP LPC9xx devices in the following packages: TSSOP, HVSON10 , HQVFN28 , mount parts such as the HVSON10 and HQVFN28. All signals from every socket (except PLC44) are brought , HVSON10 & HQVFN28 · On board LED for testing Technical Details SAB9 Supported Devices Device , P89LPC93xFDH P89LPC9107FDH P89LPC9102FTK HVSON10 P89LPC9103FTK P89V52xxA PLCC44 USB-ICP-SAB9 shown
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HVSON10,
HQVFN28,
DIP28.
HVSON10
HQVFN28.
PLC44)
14-pin,
92xFDH
P89LPC93xFDH
P89LPC9107FDH
USB-ICP-SAB9
PLC44
PLCC44 socket
P89LPC9102FTK
P89LPC9103FTK
P89LPC9107FDH
PLCC44
80C51
DIP28
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2011 - Not Available
Abstract: No abstract text available
Text: ON 10 SOT650-2 HV S HVSON10 ; reel pack; standard product orientation; 12NC ending 138 Rev. 1 â 21 September 2011 Packing information 1. Packing method Printed plano box , -2 NXP Semiconductors HVSON10 ; reel pack; standard product orientation; 12NC ending 138 2. Product , HVSON10 ; reel pack; standard product orientation; 12NC ending 138 4. Reel dimensions A Z W2 , © NXP B.V. 2011. All rights reserved. 3 of 4 SOT650-2 NXP Semiconductors HVSON10 ; reel pack
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OT650-2
HVSON10;
001aak603
OT650-2
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2003 - MRC317
Abstract: HVSON-10 PCF50604 charger of battery PHILIPS CD 245 Fast Charge Wireless Charger
Text: Charger detection · Built-in current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal , guarantee fail-safe operation. PACKAGE TYPE NUMBER NAME UBA2007TK/N2 HVSON10 DESCRIPTION plastic thermal , specification of HVSON10 package, see Chapter 12. Fig.2 Pin configuration. 2003 Oct 01 5 Philips , . HVSON10 is mounted to a water-cooled heatsink with the topside of the package. Package is mounted to a 4 , 14 Philips Semiconductors Product specification Charge switch 12 PACKAGE OUTLINE HVSON10
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807IRELESS
SCA75
613502/01/pp19
MRC317
HVSON-10
PCF50604
charger of battery PHILIPS CD 245
Fast Charge Wireless Charger
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2008 - Not Available
Abstract: No abstract text available
Text: × 3.0 mm × 0.85 mm HVSON10 package NXP Semiconductors SA58672 3.0 W mono class-D audio , . Ordering information Package Name SA58672TK SA58672UK HVSON10 WLCSP9 Description plastic thermal enhanced , Transparent top view (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 , B2 C2 A3 B3 C3 HVSON10 4 2 3 5 9 1 7 8 10 6 (DAP) channel positive input analog supply voltage (level , SD other pins WLCSP9; derating factor 10 mW/K Tamb = 25 °C Tamb = 75 °C Tamb = 85 °C HVSON10
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SA58672
SA58672
10-terminal
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2009 - Not Available
Abstract: No abstract text available
Text: × 3.0 mm × 0.85 mm HVSON10 package NXP Semiconductors SA58672 3.0 W mono class-D audio , . Ordering information Package Name SA58672TK SA58672UK HVSON10 WLCSP9 Description plastic thermal enhanced , Transparent top view (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 , B2 C2 A3 B3 C3 HVSON10 4 2 3 5 9 1 7 8 10 6 (DAP) channel positive input analog supply voltage (level , SD other pins WLCSP9; derating factor 10 mW/K Tamb = 25 °C Tamb = 75 °C Tamb = 85 °C HVSON10
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SA58672
SA58672
10-terminal
prov26
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2004 - LPC915
Abstract: TSSOP28 13483 a 13483 EPM900 LPC912 P89lpc901 80C51 LPC900 LPC917
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC91x family Big
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P89LPC91x
80C51
14-pin/
16-pin
P89LPC912/913/914/915/916/917
LPC900
80C51
LPC915
TSSOP28
13483
a 13483
EPM900
LPC912
P89lpc901
LPC917
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2004 - lpc901
Abstract: P89LPC90x lpc903 PAB90x-2 PAB90x-1 P89lpc901 p89lpc904 LPC904 TSSOP28 80C51
Text: TSSOP20, DIP20 TSSOP16 TSSOP16 TSSOP14 TSSOP14 TSSOP14 TSSOP14 TSSOP14 HVSON10 HVSON10 SO8 SO8
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P89LPC90x
80C51
P89LPC901/902/903/904/906/907/908
LPC900
80C51
lpc901
lpc903
PAB90x-2
PAB90x-1
P89lpc901
p89lpc904
LPC904
TSSOP28
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2004 - TSSOP20 FOOTPRINT
Abstract: HVSON10 P89LPC935 TSSOP28 EPM900 80C51 P89LPC92x P89LPC931 P89LPC932A1 P89LPC933
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC92x family Big
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P89LPC92x
80C51
20-pin
P89LPC920/921/922/924/925
LPC900
80C51
TSSOP20 FOOTPRINT
HVSON10
P89LPC935
TSSOP28
EPM900
P89LPC931
P89LPC932A1
P89LPC933
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2004 - HVQFN28
Abstract: TSSOP28 LPC935 LPC938 P89LPC936 TSSOP-28 P89LPC93x EPM900 isp iap LPC935 80C51
Text: TSSOP14 HVSON10 HVSON10 SO8 SO8 SO8 SO8, DIP8 SO8 SO8, DIP8 SO8, DIP8 P89LPC93x family
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P89LPC93x
28-pin
P89LPC930/931/932A1/933/934/935/936/938
LPC900
HVQFN28
TSSOP28
LPC935
LPC938
P89LPC936
TSSOP-28
EPM900
isp iap LPC935
80C51
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2003 - charger of battery PHILIPS CD 245
Abstract: pcf50604 convection oven temperature sensor handset charger circuit diagram SWITCH MODE CURRENT SOURCE HVSON10 UBA2007 MRC317 MRC313
Text: detection · Built-in current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal properties , ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UBA2007TK/N2 2003 Oct 01 HVSON10 DESCRIPTION , MRC313 This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12 , CONDITIONS UNIT 22(2) note 1 VALUE K/W Notes 1. HVSON10 is mounted to a water-cooled , Semiconductors Product specification Charge switch UBA2007 12 PACKAGE OUTLINE HVSON10 : plastic
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UBA2007
SCA75
613502/01/pp19
charger of battery PHILIPS CD 245
pcf50604
convection oven temperature sensor
handset charger circuit diagram
SWITCH MODE CURRENT SOURCE
HVSON10
UBA2007
MRC317
MRC313
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2009 - portable dvd player schematic diagram of video
Abstract: class d power amplifier SA58672TK AUX0025 BLM21PG221SN1 HVSON10 MO-229 MPZ1608S221A SA58672UK ipod repair
Text: dissipation with 3.0 mm × 3.0 mm × 0.85 mm HVSON10 package SA58672 NXP Semiconductors 3.0 W mono , SA58672TK HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals , (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 SA58672 , . Symbol Pin description Pin Description WLCSP9 HVSON10 INP A1 4 channel positive , WLCSP9; derating factor 10 mW/K HVSON10 ; derating factor 20 mW/K Tamb ambient temperature
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SA58672
SA58672
10-terminal
portable dvd player schematic diagram of video
class d power amplifier
SA58672TK
AUX0025
BLM21PG221SN1
HVSON10
MO-229
MPZ1608S221A
SA58672UK
ipod repair
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2003 - pcf50601
Abstract: UBA2008 MRC319 UBA2008TK PCF50604 MRC318 HVSON10
Text: Small 3 × 3 mm HVSON10 package with excellent thermal properties · The UBA2008 is qualified according , NUMBER NAME UBA2008TK/N2 2003 Oct 01 HVSON10 DESCRIPTION plastic thermal enhanced very thin , This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12. Fig , 22(2) note 1 VALUE K/W Notes 1. HVSON10 is mounted to a water-cooled heatsink with the , UBA2008 12 PACKAGE OUTLINE HVSON10 : plastic thermal enhanced very thin small outline package; no leads
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UBA2008
SCA75
613502/01/pp19
pcf50601
UBA2008
MRC319
UBA2008TK
PCF50604
MRC318
HVSON10
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2008 - HSVON10
Abstract: nxp pcf2120 HVSON10 JESD22-A114 JESD22-A115 JESD78 MO-229 PCF2120TK PCF2120U
Text: . Ordering information Type number Package Name Description PCF2120TK HVSON10 plastic , Fig 2. Pin configuration HVSON10 package PCF2120_1 Product data sheet 001aah559 Fig 3 , . Pin description Symbol Pin Pad Description HVSON10 Wire bond die n.c. 1 - , 7 of 14 PCF2120 NXP Semiconductors Quartz oscillator 14. Package outline HVSON10 , PROJECTION ISSUE DATE 01-01-22 02-02-08 Fig 9. Package outline SOT650-1 ( HVSON10 ) PCF2120
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PCF2120
PCF2120
HSVON10
nxp pcf2120
HVSON10
JESD22-A114
JESD22-A115
JESD78
MO-229
PCF2120TK
PCF2120U
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MO-229
Abstract: HVSON10 sot650 HVSON-10
Text: PDF: 2001 Jan 22 Philips Semiconductors Package outline HVSON10 : plastic, heatsink very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.90 mm SOT650-1 y1 C X y A B D E A terminal 1 index area C A4 detail X v M B w M b 1 5 L Eh Bottom view 6 10 e Dh DIMENSIONS (mm are the original dimensions) A UNIT max. mm 0.90 OUTLINE VERSION SOT650-1 A4 b D Dh E Eh e L v w y
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HVSON10:
OT650-1
MO-229
MO-229
HVSON10
sot650
HVSON-10
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2010 - Not Available
Abstract: No abstract text available
Text: Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 index area detail X terminal 1 index area e1 e L C b 1 5 C A B C v w y1 C y Eh 10 6 Dh 0 5 mm scale Dimensions (mm are the original dimensions) Unit A A1 b max 1.00 0.05 0.80 nom 0.85 0.02 0.70 min 0.80 0.00 0.60 mm c 0.2 D(1) Dh
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HVSON10:
OT1325-1
MO-229
sot1325-1
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2003 - MRC319
Abstract: MRC320 pcf50601 MRC314 PCF50604 MRC318
Text: current sensing · Small 3 × 3 mm HVSON10 package with excellent thermal properties · The UBA2008 is , NUMBER NAME UBA2008TK/N2 HVSON10 DESCRIPTION plastic thermal enhanced very thin small outline package; no , MRC319 This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12 , SYMBOL Rth(j-c) Notes 1. HVSON10 is mounted to a water-cooled heatsink with the topside of the package , 14 Philips Semiconductors Product specification Charge switch 12 PACKAGE OUTLINE HVSON10
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807IRELESS
SCA75
613502/01/pp19
MRC319
MRC320
pcf50601
MRC314
PCF50604
MRC318
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2010 - NX3L4684
Abstract: HVSON10 MO-229 NX3L4684GM NX3L4684TK
Text: HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 × 3 × 0.85 , configuration SOT1049-2 (XQFN10U) Fig 4. Pin configuration SOT650-1 ( HVSON10 ) 7.2 Pin description , packages: above 132 °C the value of Ptot derates linearly with 14.1 mW/K. For HVSON10 packages: above 135 , NX3L4684 NXP Semiconductors Dual low-ohmic single-pole double-throw analog switch HVSON10 : plastic , ISSUE DATE 01-01-22 02-02-08 Fig 32. Package outline SOT650-1 ( HVSON10 ) NX3L4684_4 Product data
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NX3L4684
NX3L4684
HVSON10
MO-229
NX3L4684GM
NX3L4684TK
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2009 - SA58672TK
Abstract: SA58672UK SA58672 portable dvd player schematic diagram of video AUX0025 BLM21PG221SN1 HVSON10 MO-229 MPZ1608S221A ipod repair
Text: dissipation with 3.0 mm × 3.0 mm × 0.85 mm HVSON10 package SA58672 NXP Semiconductors 3.0 W mono , SA58672TK HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals , (1) Exposed Die Attach Paddle (DAP). Fig 4. Pin configuration for HVSON10 SA58672 , . Symbol Pin description Pin Description WLCSP9 HVSON10 INP A1 4 channel positive , WLCSP9; derating factor 10 mW/K HVSON10 ; derating factor 25 mW/K Tamb ambient temperature
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SA58672
SA58672
10-terminal
SA58ns
SA58672TK
SA58672UK
portable dvd player schematic diagram of video
AUX0025
BLM21PG221SN1
HVSON10
MO-229
MPZ1608S221A
ipod repair
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2004 - Not Available
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVSON10 package SOT650-1 Gx D (0.105) P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy SPx tot SPy tot SPx
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HVSON10
OT650-1
OT650-1
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1996 - HVSON10
Abstract: MO-229
Text: PDF: 2002 Feb 08 Philips Semiconductors Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh
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HVSON10:
OT650-1
MO-229
HVSON10
MO-229
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2008 - Diodes smd E5H
Abstract: PCA9632DP2 HVSON10 sot552-1 JESD22-A114 JESD22-A115 JESD78 PCA9632 PCA9632DP1 PCA9633
Text: : TSSOP8, TSSOP10, HVSON8, HVSON10 3. Applications I I I I I RGB or RGBA LED drivers for color , 0.85 mm SOT908-1 PCA9632TK2 9632 HVSON10 plastic thermal enhanced very thin small , view Pin configuration for HVSON8 Fig 5. Pin configuration for HVSON10 6.2 Pin description , + I2C-bus low power LED driver Table 3. Pin description for TSSOP10 and HVSON10 Symbol Pin , SDA 9 I/O serial data line VDD 10 power supply supply voltage [1] HVSON10
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PCA9632
PCA9632
PCA9633
Diodes smd E5H
PCA9632DP2
HVSON10
sot552-1
JESD22-A114
JESD22-A115
JESD78
PCA9632DP1
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2009 - Not Available
Abstract: No abstract text available
Text: Package outline HVSON10 : plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm SOT650-2 X A B D E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L K Eh 10 6 Dh 0 1 Dimensions Unit mm 2 mm scale A(1) A1 b max 1.00 0.05 0.30 nom 0.85 0.03 0.25 min 0.80 0.00 0.18 c D(1) Dh E(1) Eh e e1 K L
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HVSON10:
OT650-2
MO-229
sot650-2
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2009 - HVSON10
Abstract: JESD22-A114E MO-229 NX3L4684 NX3L4684GM NX3L4684TK
Text: -2 NX3L4684TK -40 °C to +125 °C HVSON10 plastic thermal enhanced very thin small outline package; no , . Transparent top view Pin configuration SOT1049-2 (XQFN10U) Fig 4. Pin configuration SOT650-1 ( HVSON10 , mW/K. For HVSON10 packages: above 135 °C °C the value of Ptot derates linearly with 17.2 mW/K. 10 , Semiconductors Dual low-ohmic single-pole double-throw analog switch HVSON10 : plastic thermal enhanced very , 02-02-08 Fig 32. Package outline SOT650-1 ( HVSON10 ) NX3L4684_2 Product data sheet © NXP B.V. 2009
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NX3L4684
NX3L4684
HVSON10
JESD22-A114E
MO-229
NX3L4684GM
NX3L4684TK
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