2011 - motherboards
Abstract: No abstract text available
Text: 8 kV 8 kV 7 kV 8 kV 6 kV 4 kV 6 kV HVQFN-48 7x7x-0.5mm HVQFN-48 7x7x-0.5mm HVQFN-48 7x7x-0.5mm HVQFN-48 7x7x-0.5mm HVQFN-48 7x7x-0.5mm HVQFN-48 7x7x-0.5mm HVQFN-48 , 1920x1200; 150 mW Standby; 500 mW Init } HVQFN48 , 7x7 mm, 0.5 mm pitch } ESD 7 kV HBM PTN3392 DP-VGA
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TFBGA-64
motherboards
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2013 - Not Available
Abstract: No abstract text available
Text: SOT619-1 HVQFN48 ; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code (12NC) ending 518 Rev. 1 â 21 October 2013 1. Packing method Fig 1. Dry reel pack for SMD Packing information SOT619-1 NXP Semiconductors HVQFN48 , HVQFN48 ; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or , reserved. 3 of 4 SOT619-1 NXP Semiconductors HVQFN48 ; Reel dry pack, SMD, 13" Q1/T1 standard
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OT619-1
HVQFN48;
OT619-1
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2010 - Not Available
Abstract: No abstract text available
Text: and RXRDY signals. (TXRDY and RXRDY signals are not available in the HVQFN48 package.) On-board , temperature range, and is available in plastic PLCC68, LQFP64, LQFP80, and HVQFN48 packages. On the HVQFN48 , low profile quad flat package; 64 leads; body 7 Ã 7 Ã 1.4 mm SOT414-1 SC16C554BIBS HVQFN48 , RXA 5.1.4 HVQFN48 CTSA 1 36 INTD VCC 2 35 CSD RTSA 3 34 TXD INTA 4 , Description PLCC68 LQFP64 LQFP80 HVQFN48 16/68 31 - - 14 I 16/68 Interface type select
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SC16C554B/554DB
16-byte
SC16C554B/554DB
ST16C554
TL16C554
16C454.
SC16C554B/554DB.
554DB
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2007 - UXF23460
Abstract: uxf23480 RC 2.4 GHz vco 2.8 ghz HVQFN48 WiMAX transceivers
Text: quad flat plastic HVQFN48 package of V 7 x 7 x 0.85 mm Key benefits Ñ Integrated receiver , 2.5 2.7 HVQFN48 (SOT619-1) ICC (mA) CPO_RF VTUNE_RF Adjacent channel rejection (dBc
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UXF234xx
UXF234xx
001aae754
UXF23460
uxf23480
RC 2.4 GHz
vco 2.8 ghz
HVQFN48
WiMAX transceivers
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2010 - SmD TRANSISTOR t1w
Abstract: transistor smd t1W 16C454 HVQFN48 LQFP64 LQFP80 PLCC68 SC16C554B ST16C554 TL16C554
Text: and RXRDY signals. (TXRDY and RXRDY signals are not available in the HVQFN48 package.) On-board , temperature range, and is available in plastic PLCC68, LQFP64, LQFP80, and HVQFN48 packages. On the HVQFN48 , profile quad flat package; 64 leads; body 7 × 7 × 1.4 mm SOT414-1 SC16C554BIBS HVQFN48 plastic , area 47 GND 48 RXA 5.1.4 HVQFN48 CTSA 1 36 INTD VCC 2 35 CSD RTSA 3 , Pin description Pin Type Description PLCC68 LQFP64 LQFP80 HVQFN48 16/68 31 - -
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SC16C554B/554DB
16-byte
SC16C554B/554DB
ST16C554
TL16C554
16C454.
SC16C554B/554DB.
554DB
SmD TRANSISTOR t1w
transistor smd t1W
16C454
HVQFN48
LQFP64
LQFP80
PLCC68
SC16C554B
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2002 - HVQFN48
Abstract: ISP1181B TSSOP48
Text: Complies with ACPITM, OnNowTM and USB power management requirements · TSSOP48 and HVQFN48 packages Available in TSSOP48 and HVQFN48 packages, the ISP1181B is supported by complete evaluation kits and
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ISP1181B
ISP1181B
HVQFN48
TSSOP48
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2005 - SC16C554B_554DB
Abstract: logic control of conveyor 16C454 TL16C554 plcc68 socket smd transistor txa HVQFN48 LQFP64 LQFP80 PLCC68
Text: . (TXRDY and RXRDY signals are not available in the HVQFN48 package.) On-board status registers provide , is available in plastic PLCC68, LQFP64, LQFP80, and HVQFN48 packages. On the HVQFN48 package only , ; 64 leads; body 7 × 7 × 1.4 mm SOT414-1 SC16C554BIBS HVQFN48 plastic thermal enhanced very , RXA 5.1.4 HVQFN48 CTSA 1 36 INTD VCC 2 35 CSD RTSA 3 34 TXD INTA 4 , HVQFN48 16/68 31 - - 14 I 16/68 Interface type select (input with internal pull-up).
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SC16C554B/554DB
16-byte
SC16C554B/554DB
ST16C554
TL16C554
16C454.
SC16C554B/554DB.
16-byte
SC16C554B_554DB
logic control of conveyor
16C454
plcc68 socket
smd transistor txa
HVQFN48
LQFP64
LQFP80
PLCC68
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2010 - Not Available
Abstract: No abstract text available
Text: consuming a small amount of power (230 mW typ.) and is offered in a 48-terminal HVQFN48 package. PTN3360D , terminals Transparent operation: no re-timing or software configuration required 48-terminal HVQFN48 package , information Package Name PTN3360DBS HVQFN48 Description plastic thermal enhanced very thin quad flat package , leads; 48 terminals; body 7 × 7 × 0.85 mm Version SOT619-1 Type number PTN3360DBS/S900 HVQFN48 , OUT_D2- 20 VDD 21 OUT_D1+ 22 Transparent top view HVQFN48 package supply ground is connected to
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PTN3360D
PTN3360D
36-bit
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2010 - PTN3360DBS
Abstract: PTN3360D PTN3360DSS HVQFN48 MO-220 SMD phase shifter clock enable SOT619-1 thermal resistance PTN3360
Text: offered in a 48-terminal HVQFN48 package. PTN3360D has two pinning options. PTN3360DBS has its pin 6 as , required 48-terminal HVQFN48 package with two pinning options. PTN3360DBS has its pin 6 as REXT, and , Version PTN3360DBS HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 × 7 × 0.85 mm SOT619-1 PTN3360DBS/S900 HVQFN48 plastic thermal enhanced very , Transparent top view HVQFN48 package supply ground is connected to both GND pins and exposed center pad
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PTN3360D
PTN3360D
36-bit
PTN336.
PTN3360DBS
PTN3360DSS
HVQFN48
MO-220
SMD phase shifter clock enable
SOT619-1 thermal resistance
PTN3360
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HVQFN48
Abstract: MO-220 k MO-220 sot619 e1a4
Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48 : plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-2 B D D1 A terminal 1 index area A E1 A4 A1 E detail X k k e1 b e C v M B y y1 C w M 13 24 v M A L 25 12 e e1 Eh 1 36 48 37 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.00 OUTLINE
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HVQFN48:
OT619-2
MO-220
HVQFN48
MO-220 k
MO-220
sot619
e1a4
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2004 - Not Available
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT778-1 Hx Gx D P C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P Ax Ay Bx By C D SLx
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HVQFN48
OT778-1
OT778-1
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Not Available
Abstract: No abstract text available
Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48 : plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-1 D B A terminal 1 index area A E A4 detail X e1 e 13 L 12 b w M 24 v M B y1 C v M A 25 C y e Eh e1 1 48 Dh 0 DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.00 A4 0.80 0.65 b 0.27 0.15 D 7.05 6.95 Dh 5.25 4.95 E 7.05 6.95 Eh 5.25 4.95 e 0.5 e1 5.5 37 36 X 2.5 scale 5 mm L
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HVQFN48:
OT619-1
MO-220
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B13W
Abstract: HVQFN48 Thin Quad flat package mo-220 MO-220 sot619
Text: PDF: 2001 Sep 07 Philips Semiconductors Package outline HVQFN48 : plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-3 B D D1 A terminal 1 index area A E1 A4 A1 E detail X C e1 1/2 e e y y1 C v M C A B b 13 w M C 24 L 25 12 e e2 Eh 1/2 e pin 1 index 1 36 48 37 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm
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HVQFN48:
OT619-3
MO-220
B13W
HVQFN48
Thin Quad flat package mo-220
MO-220
sot619
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2004 - Not Available
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-1 Hx Gx D P C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P Ax Ay Bx By C D SLx
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HVQFN48
OT619-1
OT619-1
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2005 - K120C
Abstract: 16C454 HVQFN48 LFBGA64 LQFP64 PLCC68 SC16C654B ST16C654 TL16C754
Text: signals are not available in the HVQFN48 package.) On-board status registers provide the user with error , , LQFP64, HVQFN48 and LFBGA64 packages. On the HVQFN48 package, only channel C has all the modem pins , package; 64 leads; body 7 × 7 × 1.4 mm SOT414-1 SC16C654BIBS HVQFN48 plastic thermal enhanced , 47 GND 48 RXA Fig 6. Pin configuration for HVQFN48 (16 mode) CTSA 1 36 n.c. VCC , top view Fig 7. Pin configuration for HVQFN48 (68 mode) 9397 750 14965 Product data sheet
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SC16C654B/654DB
64-byte
SC16C654B/654DB
ST16C654
TL16C754
16C454.
SC16C654B/654DB.
K120C
16C454
HVQFN48
LFBGA64
LQFP64
PLCC68
SC16C654B
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2012 - PTN3360BS
Abstract: HDMI receiver ic "to DisplayPort" HDMI 1.4 output 4k PTN3360
Text: (230 mW typical) and is offered in a 48-terminal HVQFN48 package. NXP Semiconductors PTN3360D , Transparent operation: no re-timing or software configuration required 48-terminal HVQFN48 package 3 , Topside mark PTN3360DBS Package Name PTN3360DBS HVQFN48 Description plastic thermal enhanced very thin , OUT_D2- 20 VDD 21 OUT_D1+ 22 Transparent top view HVQFN48 package supply ground is connected to , pad region. Fig 3. Pin configuration for HVQFN48 PTN3360D All information provided in this
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PTN3360D
PTN3360D
36-bit
PTN3360BS
HDMI receiver ic
"to DisplayPort"
HDMI 1.4 output 4k
PTN3360
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2008 - Not Available
Abstract: No abstract text available
Text: Package outline HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm D SOT619-6 A B terminal 1 index area E A A1 c detail X e1 C e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1 index area 48 37 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D (1
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HVQFN48:
OT619-6
Pla075
MO-220
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2008 - Not Available
Abstract: No abstract text available
Text: Package outline HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-4 A B terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 24 M M y y1 C C A B C L 25 12 e e2 Eh 1/2 e 1 36 terminal 1 index area 48 37 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D(1) Dh
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HVQFN48:
OT778-4
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2002 - HVQFN48
Abstract: MO-220 sot619
Text: PDF: 2002 Oct 02 Philips Semiconductors Package outline HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-4 terminal 1 index area A E A1 c detail X C e1 e 1/2 e v M C A B w M C b 13 24 L 25 12 e e2 Eh 1/2 37 48 Dh X 0 2.5 mm max. A1 b 1 0.05 0.00 0.30 0.18 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT
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HVQFN48:
OT619-4
MO-220
HVQFN48
MO-220
sot619
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2004 - HVQFN48
Abstract: sot778
Text: Package outline Philips Semiconductors HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-4 terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 M M y1 C C A B C y 24 L 25 12 e e2 Eh 1/2 e 1 36 terminal 1 index area 48 37 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1
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HVQFN48:
OT778-4
HVQFN48
sot778
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2008 - Not Available
Abstract: No abstract text available
Text: Package outline HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-2 A B terminal 1 index area E A A1 c detail X C e1 e v w b 1/2 e 13 24 M M y1 C C A B C y L 25 12 e e2 Eh 1/2 e 1 terminal 1 index area 36 48 37 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 b c D (1) Dh
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HVQFN48:
OT778-2
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2005 - Not Available
Abstract: No abstract text available
Text: signals are not available in the HVQFN48 package.) On-board status registers provide the user with error , , LQFP64, HVQFN48 and LFBGA64 packages. On the HVQFN48 package, only channel C has all the modem pins , package; 64 leads; body 7 à 7 à 1.4 mm SOT414-1 SC16C654BIBS HVQFN48 plastic thermal , for HVQFN48 (16 mode) CTSA 1 36 n.c. VCC 2 35 CSD RTSA 3 34 TXD IRQ 4 , HVQFN48 (68 mode) 9397 750 14965 Product data sheet © Koninklijke Philips Electronics N.V. 2005
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SC16C654B/654DB
64-byte
SC16C654B/654DB
ST16C654
TL16C754
16C454.
SC16C654B/654DB.
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2004 - Not Available
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-2 Hx Gx D P C (0.105) SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste nSPx nSPy 3 occupied area 3 DIMENSIONS in mm P Ax Ay Bx By C D SLx
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HVQFN48
OT619-2
OT619-2
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1996 - HVQFN48
Abstract: MO-220
Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-2 B D D1 A terminal 1 index area E1 A E A4 A1 c detail X C e1 e 1/2 e 13 24 L y y1 C v M C A B w M C b 25 12 e e2 Eh 1/2 e 1 36 terminal 1 index area 48 37 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original
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HVQFN48:
OT619-2
MO-220
HVQFN48
MO-220
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2004 - HVQFN48
Abstract: MO-220 sot619
Text: Package outline Philips Semiconductors HVQFN48 : plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 M M y1 C C A B C y 24 L 25 12 e e2 E1 1/2 e 1 36 terminal 1 index area 48 37 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1
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HVQFN48:
OT619-5
MO-220
HVQFN48
MO-220
sot619
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