HM514256JP Search Results

Contextual Info: HB56D51236 Series 524,288-Word x 36-Bit High Density Dynamic RAM Module • DESCRIPTION The HB56D51236B is a 512k x 36 dynamic RAM module, mounted 16 pieces of 1 Mbit DRAM HM514256JP sealed in SOJ package and 8 pieces of 256k-bit DRAM (HM51256CP) sealed in PLCC package. An outline of the HB56D51236B is

Contextual Info: i4inba03 HB56D25632 Series- IHITS T44 T-4& -Z3-17 262,144-Word x 32-Bit High Density Dynamic RAM Module • DESCRIPTION DOIIDIR ■ PIN OUT The HB56D25632B is a 256k x 32 dynamic RAM module, mounted 8 pieces of 1 Mbit DRAM HM514256JP sealed in SOJ package. An outline of the HB56D25632B is 72-pin sin­

Contextual Info: HB56D25632 S e rie s -262,144-Word x 32-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN OUT The HB56D25632B is a 256k x 32 dynamic R A M module, mounted 8 pieces of 1 Mbit D R A M HM514256JP sealed in S O J package. An outline of the HB56D25632B is 72-pin sin­

Contextual Info: HB56D51236B-85/10/12-524,288-W ord x 36-Bit High Density Dynamic RAM Module Pin No. • DESCRIPTION The HB56D51236B is a 512K x 36 dynamic RAM module, mounted 16 pieces of 1Mbit DRAM HM514256JP sealed in SOJ package and 8 pieces of 256Kbit DRAM (HM51256CP) sealed in

Contextual Info: HB56D25632 S eries-262,144-Word x 32-Bit High Density Dynamic RAM Module • DESCRIPTION ■ PIN OUT The HB56D25632B is a 256k x 32 dynamic RAM module, mounted 8 pieces of 1 Mbit DRAM HM514256JP sealed in SOJ package. An outline of the HB56D25632B is 72-pin sin­

Contextual Info: HB56D51232 Series 524,288-Word x 32-Bit High Density Dynamic RAM Module • DESCRIPTION The HB56D51232SB is a 512k x 32 dynamic RAM mod­ ule, mounted 16 pieces of 1 Mbit DRAM HM514256JP sealed in SOJ package. An outline of the HB56D51232SB is 72-pin single in-line package. Therefore, the HB56D51232SB

Contextual Info: H B 5 6 D 5 1 2 3 2 Series - S1 E G01111D » HITACHI/ 524,288-Word x 32-Bit High Density Dynamic RAM Module LOGIC/ARRAYS/MEH • PIN OUT ■ DESCRIPTION The HB56D51232SB is a 512k x 32 dynamic RAM mod­ ule, mounted 16 pieces of 1 Mbit DRAM HM514256JP sealed in SOJ package. An outline of the HB56D51232SB is

Contextual Info: HB56D25636 Series 262,144-Word x 36-Bit High Density Dynamic RAM Module • DESCRIPTION The HB56D25636B is a 256k x 36 dynamic R A M module, mounted 8 pieces of 1 Mbit DRAM HM514256JP sealed in S O J package and 4 pieces of 256k-bit D R A M (HM51256CP) sealed in P L C C package. An outline of the HB56D25636B is

Contextual Info: HB56D25609A/B-85A/10A/12A 262,144-Word x 9-Bit High Density Dynamic RAM Module Pin No. • DESCRIPTION The HB56A25609 is a 256K x 9 dynamic RAM module, mounted two 1-Mbit DRAM HM514256A sealed in SOJ package and 256Kbit DRAM (HM51256) sealed in PLCC package. An outline of the

HM514256AJP8

Contextual Info: HM514256S Series-HM514256A Series 262144-Word x 4-Bit CMOS Dynamic RAM HM514256SP Series HM514256AP Series The Hitachi HM514256S/A is a C M O S dynamic RAM organized 262144-word x 4-bit. HM514256S/A has realized higher density, higher performance and various functions by employing 1.3 jxm

hb56d25609

Contextual Info: HB56D25609A/B-85A/10A/12A 262,144-Word x 9-Bit High Density Dynamic RAM Module P in Name Pin No. 1 Vc c 16 2 CAS 17 Ag 3 DQo 18 NC 4 A« 19 5 A, 20 dq 6 D Q, 21 WE 7 A 2 22 V ss 8 A3 23 dq 9 V ss 24 NC 10 dq 11 a P in No. The HB56A25609 is a 256K x 9 dynamic RAM module, mounted

free transistor equivalent book 2sc

Abstract: HA13108 HL7801G HL7801E free thyristor equivalent book 2sc 2SC1707 HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint HD44237 semi catalog pic micro weighing scale code example
Contextual Info: RELIABILITY 1. 1.1 R E L IA B IL IT Y R E L IA B IL IT Y C H A R A C T E R IS T IC S F O R S E M IC O N D U C T O R D E V IC E S Hitachi semiconductor devices are designed, manufactured and inspected so as to achieve a high level of reliability. Accordingly, system reliability can be improved by com­

HM6116L

Abstract: HM51256P HN62404P HM65256AP HN27C301G HN613128P hn623257 HM6147 HN27256P HN613128FP
Contextual Info: • PACKAGE INFORMATION • Dual-in-line Plastic Unit: mm {inch Scale 1/1 • D P -1 6 B • D P -1 8 19 2 Í0 756) 20 32m a , J L 2 54 - 0 .2 5 C 48 - O f <■ 0 !00 ' 0 0 10> ( o 0 19 ' 0 0 0 4 ) ■J-L 0 l5 ii '"To.OlO-.«» 2 54 * 0 25 □ Í8 • 0

HM514256A/AL

Contextual Info: HB56D25608A/B-6H/7H/8A/10A/12A 262,144-Word x 8-Bit High Density Dynamic RAM Module Pin No. Pin Name ^ cc 16 DQ4 2 CAS 17 ^8 18 NC • FEATURES • 30-Pin Single In-Line Package Lead Pitch . 2.54mm

Contextual Info: HB56D25636B-85/10/12-262,144-Word x 36-Blt High Density Dynamic RAM Module Pin Name Pin No. Pin Name 1 ^ ss 37 D Q 17 2 DQo 38 DQ« 3 39 v ss 4 D Q ib DQ, 40 CASO 5 DQ„ 41 CÄS2 6 dq2 42 CÄS3 7 DQ20 DQ, 43 CASI 44 RÄSÖ NC Pin No. • DESCRIPTION

Contextual Info: HB56D25608A/B-6H/7H/8 A/10A/12A 262,144-Word x 8-Bit High Density Dynam ic RA M Module Pin No. • D ESCRIPTIO N The HB56A25608 is a 256K x 8 dynamic RAM module, mounted two 1-Mbit D RAM HM514256A sealed in S O J package. An outline of the HB56A25609 is 30-pin single in-line package having Lead