HGLM-1063 Search Results
HGLM-1063 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 54242-106361050LF |
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
| 54111-106361500LF |
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
| 54121-106361000LF |
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
| 54121-106361250LF |
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
| 10127721-063LF |
|
Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 6 Position, 3.2mm Kink Tail (15u\\ Gold) plating, Non GW Compatible LCP, Black Color,Tray Packing. |
HGLM-1063 Datasheets (1)
Agilent Technologies
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| HGLM-1063 | Agilent Technologies | Fibre Channel GBaud Optical Link Module | Original | 202.48KB | 10 |
HGLM-1063 Price and Stock
Hewlett Packard Co
