e78996 india
Abstract: IRFK4H250 DIODE 3L2 E78996 rectifier module LS-108 hex-pak IRFK4J250 E271
Contextual Info: Bulletin E27105 International ^ R e c tifie r IRFK4H250,IRFK4J250 Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • • ■ • High Current Capability. UL recognised E78996. Electrically Isolated Base Plate. Easy Assembly into Equipment.
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OCR Scan
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E27105
IRFK4H250
IRFK4J250
E78996.
T0-240
f5/336
S-162
CH-8032ZURICH,
IL60067.
NJ07650.
e78996 india
DIODE 3L2
E78996 rectifier module
LS-108
hex-pak
IRFK4J250
E271
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PDF
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irfk4h250 rectifier module
Abstract: IRFK4H250
Contextual Info: INTERNATIONAL RECTIFIER bS E » • 4ÛSS452 DQltiS7S 17û ■ INR Bulletin E27105 International iïôRlRertififtr IRFK4H250,IRFK4J250 Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • • • • High Current Capability. UL recognised E78996.
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OCR Scan
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SS452
E27105
IRFK4H250
IRFK4J250
E78996.
irfk4h250 rectifier module
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PDF
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1RFK4H250
Abstract: ior e78996 IRFK4H250 IRFK4J250 E27105
Contextual Info: Bulletin E27105 • ■■ ■ international 1 jr M a i / M - A l r “| / J* ir t f -Ä Isolated Base Power HEX-pak Assembly - Parallel Chip Configuration • nign ourreni uapaointy. • UL recognised E78996. • Electrically Isolated Base Plate. • Easy Assembly into Equipment
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OCR Scan
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E27105
1RFK4H250
IRFK4J250
E78996.
T0-240
IRFK4H250
ior e78996
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PDF
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