|
TPN12008QM
|
|
Toshiba Electronic Devices & Storage Corporation
|
MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
|
|
|
20083EB0BD
|
|
Amphenol Communications Solutions
|
Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
|
|
|
65240-019LF
|
|
Amphenol Communications Solutions
|
Dubox® 2.54mm Pitch, Board to Board Connector, Crimp-to-Wire Housing, Single Row. |
PDF
|
|
|
10119109-510019LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
67000-019LF
|
|
Amphenol Communications Solutions
|
Berg Duflex Housing, single row, 19 Position. |
PDF
|
|
