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10114829-11108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions |
PDF
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54776-111-08LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 8 Positions, 2.54mm (0.100in) Pitch |
PDF
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54111-108021000LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch. |
PDF
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F31L-1A7H1-11080
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Amphenol Communications Solutions
|
Flex Connector, 0.50mm Pitch, Height 2.55mm, Right angle, Flip type, ZIF, 80 position , With MYLAR |
PDF
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54112-111082000LF
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|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch. |
PDF
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