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    CHI59-16B-23-28901 Search Results

    CHI59-16B-23-28901 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    67289-014
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating. PDF
    67289-014LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating. PDF
    67289-019
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating. PDF
    67289-019LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating. PDF
    TMS320F28377SZWTT
    		Texas Instruments Delfino™ 32-bit MCU with 400 MIPS, 1xCPU, 1xCLA, FPU, TMU, 1024 KB Flash, EMIF, 16b ADC 337-NFBGA -40 to 105 Visit Texas Instruments Buy