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TMPM311CHDUG
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Toshiba Electronic Devices & Storage Corporation
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Arm Cortex-M3 Core Based Microcontroller/32bit/LQFP48-P-0707-0.50C |
Datasheet
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133-311C-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Direct Orthogonal, Double End Wall, 2.25mm Wipe, APP. |
PDF
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71920-311CLF
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Amphenol Communications Solutions
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Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 11 position, 2.54mm (.100in) Pitch. |
PDF
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926-311C-70H
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Amphenol Communications Solutions
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XCede HD Plus, Backplane Connectors, Vertical Header, 3-pair, 6-column, Double End Wall, With Extra Ground. |
PDF
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76384-311CLF
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Amphenol Communications Solutions
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Dubox® 2.54mm, Wire to Board Connector, Shrouded Vertical Header, Through Hole, Single row , 11 Positions, 2.54mm (0.100in) Pitch |
PDF
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