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67998-228HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail | 
PDF
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67998-220HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail | 
PDF
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10123982-201
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Amphenol Communications Solutions
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MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height. | 
PDF
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10123982-291
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Amphenol Communications Solutions
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MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height. | 
PDF
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| 
67998-226HLF
 | 
 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail | 
PDF
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