98ASA10618D Search Results
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Contextual Info: 0 .1 0 C A B V IEW M - M © FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE TITLE: THERMALLY ENHANCED QUAD FLAT N O N -LE A D E D PACKAGE QFN 2 0 TERMINAL, 0 .5 PITCH ( 4 X 4 X 1 ) PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASA10618D |
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98ASA10618D |