93-002 F Search Results

MIL-C-39012

Abstract: MILC-39012
Contextual Info: SMA Printed Circuit Mount Connectors MIL-C-39012/93 "X 4 MILITARY PART NO. MIDWEST PART NO. -3001 -3002 -3003 M39012/93-3001 M39012/93-3002 M39012/93-3003 DIMENSION A max .155 .125 .093 (3.9) (3.2) (2.4) COMMERCIAL ALTERNATE SMA-5010-93-000-00 SMA-5010-93-002-00

803-001-06 and 803-002-06 Dimensions

Abstract: Series 803 803-001
Contextual Info: Series 803 Series 803 Mighty Mouse ¼ Turn Bayonet Coupling Plug 803-001-06 and 803-002-06 Dimensions Plug connector øC A THD .93 23.6 MAX .93 (23.6) MAX Intergral Band Platform 803-001 ø B MAX Accessory Thread 803-002 Dimensions Shell Size A Thread UNEF-2A

Contextual Info: Product Number: 801-93-002-10-004000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail Single Row Through Hole Accepts .037-.043" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-93-002-10-004000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail Double Row Through Hole Accepts .037-.043" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-93-002-10-001000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail 0.118 Tail Single Row Through Hole Accepts .025-.037 .025 sq post Leads Plating Code: 93 Shell Plating: 200 " Tin/Lead(93/7) over 100 μ"

Contextual Info: Product Number: 801-93-002-40-002000 Description: Interconnect Socket .100 Grid; Right Angle Socket .030 dia leads Single Row Surface Mount Accepts .025-.037 .025 sq post" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-93-002-10-001000 Description: Interconnect Socket .100 Grid; Straight Socket Standard Solder Tail Single Row Through Hole Accepts .025-.037 .025 sq post" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-93-002-20-001000 Description: Interconnect Socket .100 Grid; Right Angle Socket .030 dia leads Single Row Through Hole Accepts .025-.037 .025 sq post Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-93-002-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .025-.037 .025 sq post" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-93-002-40-002000 Description: Interconnect Socket .100 Grid; Right Angle Socket .030 dia leads Single Row Surface Mount Accepts .025-.037 .025 sq post Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-93-002-20-001000 Description: Interconnect Socket .100 Grid; Right Angle Socket .030 dia leads Single Row Through Hole Accepts .025-.037 .025 sq post" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

MON960

Abstract: Automatic Doorbell with Object Detection Circuit i960 MC Programmers Reference Manual IQ80960RP
Contextual Info: MON960 Debug Monitor User’s Guide Order Number: 484290-006 Revision Revision History Date -001 Original Issue. 01/93 -002 Updated for V1.1 release. 02/93 -003 Revised for MON960 release 2.0. 05/94 -004 Revised for MON960 release 2.1. 11/94 -005 Revised for MON960 release 3.0.

belden rg59

Contextual Info: MIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBL1CATJO REVISIONS RELEASE -16 PER 92-3432-012-007 ' RELEASE -17 PER 33-3432-003-002 " ' REVJ5ED PER EC 0130-0235-93 ' RELEASE -18 PER 93-3432-003-001 N RELEASE -21 PER EC 0220-0117-96' * A USE PRO-CR]NPER H ; 2,

Contextual Info: Product Number: 862-90-002-00-180000 Description: Interconnect Header .070 Grid; Straight Pin Header Standard Solder Tail Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel # Of Pins Mill-Max Part Number 2 862-90-002-00-180000

Contextual Info: Product Number: 800-90-002-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Single Row Plating Code: 90 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel # Of Pins Mill-Max Part Number 2 800-90-002-20-001000

Contextual Info: Product Number: 800-90-002-10-002000 Description: Interconnect Header .100 Grid; Low Profile Pin Header .030 dia leads Single Row Through Hole Plating Code: 90 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel # Of Pins Mill-Max Part Number 2 800-90-002-10-002000

Contextual Info: Product Number: 801-99-002-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Single Row Through Hole Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating: 100 µ" Tin/Lead(93/7) over 50 µ"

Contextual Info: Product Number: 802-90-002-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Double Row Through Hole Plating Code: 90 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel # Of Pins Mill-Max Part Number 2 802-90-002-20-001000

9121 transistor

Abstract: sot-23-5 marking PFN
Contextual Info: XC9120/XC9121/XC9122 Series ETR0409 002 Step-Up DC/DC Controller IC, MAXDUTY: 93% ☆GreenOperation-Compatible •GENERAL DESCRIPTION XC9120/9121/9122 Series are PWM, PWM/PFM auto/external switching controlled step-up DC/DC converter controller ICs. Since maximum duty ratio is as large as 93%, the series is the best for the applications used as high step-up ratios, such as

intel i960 batch MARKING

Abstract: G960 I960 marking R810 80960
Contextual Info: i960 Processor Assembler User's Guide Order Number: 485276-006 Revision Revision History Date -001 Original Issue. 12/92 -002 Minor corrections. 09/93 -003 Revised for CTOOLS960 R4.5 and GNU/960 Tools R2.4. 05/94 -004 Revised for Release 5.0. 02/96 -005

G960

Abstract: I960 biga 10 document
Contextual Info: i960 Processor Assembler User’s Guide Order Number: 485276-005 Revision Revision History Date -001 Original Issue. 12/92 -002 Minor corrections. 09/93 -003 Revised for CTOOLS960 R4.5 and GNU/960 Tools R2.4. 05/94 -004 Revised for Release 5.0. 02/96 -005

Contextual Info: PASSIVE SMD DELAY LINES SINGLE OUTPUT .300 -| S 4 0 7 SERIES I .375 .350 o H .285 MAX 1 u I — .50 MAX — 1-.20 MAX M l - U-J .015 .004 _L o- — m r o — -o T T T T COPLANARITY ± .002 IMPEDANCE CODES XX = 55; 55 OHMS ±10% XX = 93; 93 OHMS

sfb455

Abstract: sn76881 diode 937 ke sn7689 sn76751n 752N
Contextual Info: V iT e x a s I n strum en ts LIMITED MAMUFACTUMM6 SPECIFICATION APRIL 2, 1980 TEXAS INSTRUMENTS LIMITED TENTATIVE SPECIFICATION 30 CHANNEL REMOTE CONTROL TRANSMITTER RES, 002 93 2 SN76742N SN76752N FORMERLY SN76831N16/832N16 THIS DESCRIPTION IS INTENDED ONLY FOR ENGINEERING EVALUATION

MD2800-D08

Abstract: md-2800-d08 MD2800 MD-2800 MD2810-D08 MD2800D08 MD2810 M-Systems md2800-d08 AP-DOC-30 dip32 package
Contextual Info: Data Sheet DiskOnChip Millennium MD2800, MD2810 8MB Single Chip Flash Disk JUL 2000 93-SR-002-00-8L Rev. 2.1 DiskOnChip Millennium Data Sheet Features Single chip, easy-to-integrate, plug-nplay flash disk Low power, single 3.3V or 5V power supply 8MB 64Mbit capacity