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10114828-11206LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions |
PDF
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54112-811121900LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10114828-11115LF
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Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions |
PDF
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10114828-11110LF
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|
Amphenol Communications Solutions
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1.25mm Wire to Board Wafer,Vertical, Surface Mount, 10 Positions |
PDF
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54112-811042400LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch. |
PDF
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