820 E12 Search Results

RIFA PHE

Abstract: RIFA PHE 820 PHE 280 phe 280 Rifa "phe 280" Rifa rifa PHE 280 820MB5100M IEC384-14 IEC68 en 132400
Contextual Info: PHE 820 EMI Suppressor Metallized Polyester PHE 820 X2, Across-the-line, Antenna-coupling, Line-by-pass 0.01 – 2.2 µF 275/300 VAC +100°C Typical applications Construction The capacitors are intended for use as Interference suppressor in X2 and ”acrossthe-line” applications.

HFBR 2412Z 1412Z

Contextual Info: HFBR-14xxZ and HFBR-24xxZ Series Low-Cost, 820 nm Miniature Link Fiber Optic Components with ST , SMA, SC and FC Ports Data Sheet Description The 820 nm Miniature Link Series of components is designed to provide cost-effective, high performance fiber optic communication links for information systems

Contextual Info: HFBR-14xxZ and HFBR-24xxZ Series Low-Cost, 820 nm Miniature Link Fiber Optic Components with ST , SMA, SC and FC Ports Data Sheet Description Features The 820 nm Miniature Link Series of components is designed to provide cost-effective, high performance fiber optic communication links for information systems

intel 8061

Abstract: 8061 intel LT1587ADJ IBM motherboard schematics 370 Intel G33 express chipset Intel G33 MOTHERBOARD CIRCUIT diagram FET SI4562DY G37 IC sio lpc chip intel p4 motherboard Z6 ITT
Contextual Info: b R Intel 820 Chipset Design Guide Addendum For the Intel® Pentium® III Processor for the PGA370 Socket Addendum to the Intel® 820 Chipset Design Guide April, 2000 Order Number: 298178 - 002 R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

Contextual Info: L max. h ± 0,5 e ± 0,5 W1 +– 10% 0,05 W2 +– 10% 0,05 18,5 19,5 8 1,2 1 URC 63 V pF MA 200 Dimensions mm L max. 23 Ø ± 0,5 8 W + 10% – 0,05 URC 100 120 120 150 150 180 180 220 220 270 270 330 330 390 390 470 470 560 560 680 680 820 820 1000 1000

Contextual Info: Type L 1210 SMD - Inductors Style 1210, moulded Specifications: Inductance range 5 nH . . . 220 pH E12 Tolerances ± 20 % (5 n . . . 820 n) ± 10 % (10 n . . .220 p) ± 5 % (33 n . . . 8,2 p) Q-factor 10 . . . 30 Resonant frequency fr 2700 . . . 7 MHz (see diagram, next page)

E12 Series

Abstract: 500kHz Datasheet of Inductance 3.3uH MITSUMI C
Contextual Info: MITSUMI C Type Series C4-E Specifications 1 3.3~820µH E12 series (2) 10~500kHz C Type Series C5-E Specifications (1) 3.3µH~1mH E12 series (2) 10~500kHz C Type Series C8-E Specifications (1) 3.3µH~1mH E12 series (2) 10~500kHz (1) Inductance (2) Operational frequency

Contextual Info: =W e9 S Pag H e Ro oir / Se TCN 201 à/to 204 CONDENSATEURS CERAMIQUE MOULES CLASSE 2 TCN 252 à/to 254 V MOLDED CERAMIC CAPACITORS CLASS 2 HAUTE TEMPERATURE HIGH TEMPERATURE 0,6 0,6 100 63 100 63 E6 E12 100 100 120 150 180 220 270 330 390 470 560 680 820

0FEEA0000h

Abstract: GBA ST1 intel schematics
Contextual Info: R Intel 820 Chipset: 82820 Memory Controller Hub MCH Datasheet November 1999 Order Number: 290630-001 ® Intel 82820 MCH R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

Contextual Info: 9 =W S age P H Ro oir / See CONDENSATEURS CERAMIQUE MOULES CLASSE 1 MOLDED CERAMIC CAPACITORS CLASS 1 63 50 63 E6 E12 E24 E48 E96 229 279 339 399 479 569 689 829 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821

Contextual Info: FLEX 8000 M U S S Programmable Logic Device Family , June 1996, ver. 8 Features. Data Sheet • ■ ■ ■ Table 1. FLEX 8000 Device Features Feature EPF8282A EPF8282AV EPF8452A EPF8636A 2,500 4,000 6,000 8,000 12,000 16,000 282 452 636 820 1,188 1,500

smm 300

Abstract: ha1831 82820 mch desktop PC MOTHERBOARD SERVICE MANUAL PC 2500H pc600 memory solution for auto shut down of P4 motherboard wcb valid bit 82801AA 82801AB
Contextual Info: R Intel 820 Chipset Family: 82820 Memory Controller Hub MCH Datasheet July 2000 Order Number: 290630-002 ® Intel 82820 MCH R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

GBA ST1

Abstract: 82801IO gba processor pinout intel schematics
Contextual Info: R Intel 820 Chipset Family: 82820 Memory Controller Hub MCH Datasheet July 2000 Order Number: 290630-002 ® Intel 82820 MCH R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

t0808

Abstract: TO816 TO220 HEATSINK rga resistors T0850
Contextual Info: “TO” Style Thick Film Resistors TO-220 Style Thick Film Heat Sink Device RGA Type TO 820 Temperature coefficient: Less than 10 ohms, 100ppm Above 10 ohms, 50ppm Features : • TO-220 style package • Miniature size • Maximum power : size ratio • High stability

PENTIUM D

Abstract: socket 775 pinout bsel pentium 4 lga775 motherboard CIRCUIT diagram
Contextual Info: Intel Pentium® D Processor 840, 830, and 820∆ Datasheet October 2005 Document Number: 307506-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

BEYSCHLAG MBA-0204-50

Abstract: BEYSCHLAG 0204-50 10K22
Contextual Info: Technical specifications SMT Package Range Load capacity Tolerance Temperature Coefficient Type/Make Form of delivery 2 Flaps FL 24/10 Contents 10 Ω 47 Ω 180 Ω 390 Ω 820 Ω 1.8 kΩ 3.9 kΩ 8.2 kΩ 18 kΩ 39 kΩ 82 kΩ 330 kΩ MBA 0204-50 Ø1.6x3.6mm

Contextual Info: 9 =W S age TCN P H Ro oir / See CONDENSATEURS CERAMIQUE MOULES CLASSE 2 MOLDED CERAMIC CAPACITORS CLASS 2 250 63 100 250 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562

AD91018

Abstract: ibm usa 2001 P6 MOTHERBOARD TRANSISTOR A107 Transistor HA17 bjt transistor c243 capacitor E4 2200uF 16V 8061 intel hp 530 motherboard power supply solution hp 530 motherboard circuit and solution C328
Contextual Info: Intel 820 Chipset Design Guide July 2000 Order Number: 290631-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability

Contextual Info: TCN 19 - 50 - 60 TCN 19A - 50A*- 60A* CONDENSATEURS CERAMIQUE MOULES CLASSE 2 63 100 250 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273

Contextual Info: 9 =W S age P H Ro oir / See CONDENSATEURS CERAMIQUE MOULES CLASSE 2 MOLDED CERAMIC CAPACITORS CLASS 2 100 200 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103

Contextual Info: “T O ” S tyle T h ic k Film R esistors TO -220 S tyle Th ic k Film H eat S in k D evice RGA Type TO 820 Temperature coefficient: Less than 10 ohms, 100ppm Above 10 ohms, 50ppm Features : • • • • • • • T O -220 style package M iniature size

Contextual Info: TCN 201 à/to 204 TCN 252 à/to 254 CONDENSATEURS CERAMIQUE MOULES CLASSE 2 0,6 0,8 URC V 100 10 pF 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10 nF 12 15 18

Contextual Info: CK 05 - CK 06 TCN 15 - TCN 16 CONDENSATEURS CERAMIQUE MOULES CLASSE 2 7,4 7,4 2,3 5,08 0,6 100 200 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183

Contextual Info: 7 ± 0,5 6,35 ± 0,5 4 1 ± 0,5 3,5 8 2,2 5 7,62 10 10,5 8,9 9 5,5 6,5 0,8 0,8 2 URC kV 27 pF 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10 nF 12 15 18 22 27 33 39 47 56 68