|
SSM10N961L
|
|
Toshiba Electronic Devices & Storage Corporation
|
N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
|
|
|
54122-805100800LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
59112-S32-08-051LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions. |
PDF
|
|
|
10132798-051100LF
|
|
Amphenol Communications Solutions
|
BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 50 position, 2.15mm height receptacle connector. |
PDF
|
|
|
54121-108051650LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
