8 RESISTOR ARRAY 10K Search Results

Chip Resistor r025

Abstract: 4r70 0603x4 245 tcr
Contextual Info: Thin Film Array Chip Resistor－CNP Series •Construction 8 7 3 4 5 6 1 2 ■Features 1 Alumina Substrate 5 Barrier Layer Ni 2 Bottom Electrode (Ag) 6 External Electrode (Sn) 3 Top Electrode (Ag-Pd) 7 Resistor Layer (NiCr) 4 Edge Electrode (Ag) 8 Overcoat (Epoxy)

SS-00254

Abstract: 4010H SS-00254-5
Contextual Info: Thick Film Array Chip Resistor—CRA Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy)

cra034r

Abstract: rh 024c 064R 024R
Contextual Info: Thick Film Array Chip Resistor—CRA Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy)

rh 024c

Abstract: 475 50K 249 024C
Contextual Info: Thick Film Array Chip Resistor—CRA Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy)

WA06Y

Contextual Info: POE International Corp SPECIFICATION OF CONVEX ISOLATED RESISTOR ARRAY M01-00-E-07 Ver: 1 Page: 1 of 8 ROHS compliance WA06Y ±5%, Convex Type General purpose chip resistors array Size 0603x2 Customer : Approval No : Issue Date : Customer Approval : POE International Corp

Contextual Info: Thick Film Array Chip Resistor－CN Series •Construction 8 9 7 3 4 5 6 2 1 1 Alumina Substrate 4 Edge Electrode Ag 7 Resistor Layer (RuO2/Ag) 2 Bottom Electrode (Ag) 5 Barrier Layer (Ni) 8 Primary Overcoat (Glass) 3 Top Electrode (Ag-Pd) 6 External Electrode (Sn)

Contextual Info: Thick Film Flat Array Chip Resistor－CN-41 •Construction 9 8 7 3 4 5 6 1 2 1 Alumina Substrate 4 Edge Electrode NiCr 7 Resistor Layer (RuO2/Ag) 2 Bottom Electrode (Ag) 5 Barrier Layer (Ni) 8 Primary Overcoat (Glass) 3 Top Electrode (Ag-Pd) 6 External Electrode (Sn)

Contextual Info: Thick Film Flat Array Chip Resistor－CN-21 & CN-41 •Construction 9 8 7 3 4 5 1 6 2 1 Alumina Substrate 4 Edge Electrode NiCr 7 Resistor Layer (RuO2/Ag) 2 Bottom Electrode (Ag) 5 Barrier Layer (Ni) 8 Primary Overcoat (Glass) 3 Top Electrode (Ag-Pd) 6 External Electrode (Sn)

marking CODE cnk

Abstract: 1f1j CODE CNK
Contextual Info: KOA SPEER ELECTRONICS, INC. SS-242 R9 AHA 8/16/12 Flat Chip Resistor Array Type CN_K/N CERTIFIED CERTIFIED 1. Features • ■ ■ ■ ■ Manufactured to Type RK73 standards Less board space than individuals chips Isolated resistor elements Convex terminations with square corners

D 83 - 004

Contextual Info: Page 8 Chip Resistor Array • • • • SEI Type RAC 4 Resistors / 8 Terminations D Concave Termination Square Comer Construction Thick Film Ruthenium Oxide Element Multiple Circuit Types Available 8 Resistors /1 0 Terminations (N/R) D A i T~ 8 Resistors /1 0 Terminations (M)

Contextual Info: Page 10 Chip Resistor Array • • • • SEI Type RAY 2 R esistors / 4 Term inations D Convex Termination Square Comer Construction Thick Film Ruthenium Oxide Element Multiple Circuit Types Available 4 Resistors / 8 Term inations (D) 8 Resistors / 1 0 Term inations (N/R)

Contextual Info: PL IA NT Features CO M • *R oH S ■ ■ ■ ■ Concave terminals Lead free RoHS compliant* 8 bit multiple applications Smallest bussed chip array ■ E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics

CAT25

Abstract: JIS-C-5202-6
Contextual Info: PL IA NT Features CO M • *R oH S ■ ■ ■ ■ Concave terminals RoHS compliant* 8 bit multiple applications Smallest bussed chip array E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics How To Order

DS1809

Contextual Info: DS1809 PRELIMINARY DS1809 Dallastat FEATURES PIN ASSIGNMENT • 64–position linear taper • Two nonvolatile wiper storage options • Operates from +2.7 to +5.5 volt supplies • Standard Resistance values: 10KΩ, 50KΩ, 100KΩ RH 1 8 VCC UC 2 7 DC STR

DCP100

Abstract: X9521
Contextual Info: Hot Pluggable X9521 Preliminary Information Fiber Channel / Gigabit Ethernet Laser Diode Control for Fiber Optic Modules Dual DCP, EEPROM Memory FEATURES DESCRIPTION • Two Digitally Controlled Potentiometers DCP’s —100 Tap - 10kΩ —256 Tap - 100kΩ

E1 to fiber optic converter circuit

Contextual Info: Hot Pluggable X9525 Preliminary Information Fiber Channel / Gigabit Ethernet Laser Diode Control for Fiber Optic Modules Dual DCP, EEPROM Memory FEATURES DESCRIPTION • Two Digitally Controlled Potentiometers DCP’s —100 Tap - 10kΩ —256 Tap - 50kΩ

TL072

Abstract: X9401 X9401WZ24 POT-64
Contextual Info: Low Noise/Low Power X9401 Preliminary Information Quad, 64 Tap, Digital Potentiometer FEATURES DESCRIPTION • • • • • • • • • • • • The X9401 digitally controlled potentiometer contains 4 separate 10KΩ potentiometers with a digitally

Variable resistor 10K ohm potentiometer

Abstract: Variable resistor 50K ohm
Contextual Info: o Increment/Decrement _ DUAL Dgital Potentiometer Prel i mi nary Technical Data AD5222 FEATURES 128 P osition, 2 C hannel P otentiom eter R eplacem ent 10K, 5 0 K, 100K, 1M Ohm V ery Low Power - 40 |iA Max ±2.7V Dual S upply O peration OR

Contextual Info: COOLPAC SERIES MODEL CPT/CPR HIGH POWER PRECISION TERMINATING RESISTORS FEATURES • Optimized performance for high frequency, high power applications • 100WCW and 10KW peak power handling ability achievable • Reactive element tuning produces tight resistance values

Contextual Info: ALA400/401 LINEAR ARRAY Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology offers the advantage of

Contextual Info: * AT&T Preliminary Data Sheet ALA400/401 Linear Array Family Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology

Thic

Abstract: 4r7 j 8c
Contextual Info: RALEC Thick Film Chip Resistors Array Product Specification 旺 詮 1 Document No. IE-SP-011 Released Date 2011/02/20 1/21 Page No. Scope: This specification is applicable to lead and halogen free RTA series thick film chip resistors array。 2 Explanation Of Part Numbers:

MASW-000834-13560T

Abstract: 1.3k ohm resistor
Contextual Info: MADR-008851-000100 PIN Diode Driver for Series / Shunt High Power Switches Rev. P2 Features Pin Configuration • High Drive Current Capability Up to 50 mA • Up to 32V Back Bias in Off State • Single CMOS Logic Input with 10K Ohm Internal Pull Down Resistor

pnp 8 transistor array

Abstract: ALA400 transistor BIPOLAR npn 8 transistor array 1000 volt pnp transistor JFET 401 ARRAY resistor DS87-61LBC kss 216 complementary JFET
Contextual Info: AT&T Preliminary Data Sheet ALA400/401 Linear Array Fam ily Description The ALA400/401 Linear Array Family is fabricated using the complementary bipolar integrated circuit CBIC process that offers the advantages of vertical NPN and vertical PNP transistors. CBIC technology