8 PIN LEAD SOP Search Results

transistor 8P

Abstract: FPT-8P-M01 M01 8-pin
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 EIAJ code : ∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold FPT-8P-M01 8-pin plastic SOP

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC To Top / Package Lineup / Package Index FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215)

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002)

FPT-8P-M08

Abstract: 530010 5 pin lead sop
Contextual Info: SMALL OUTLINE PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 8 PIN PLASTIC FPT-8P-M08 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 5.30 mm × 5.24 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height

8 pin lead sop

Abstract: FPT-8C-A01 272 8pin fpt-8c
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002) TYP 5.40(.213) TYP 3.80(.150) TYP

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold

FPT-8P-M02

Abstract: weight of SOP package
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M02 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight

S14GM-50-225B

Contextual Info: : Available, : Under development Plastic SOP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 32 40 44 225 300 375 1.27 450 525 600 Plastic SSOP Nominal Dimensions (mil) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8

TSSOP 8PIN MARK 21

Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II

PA-SOD-1603-D250-08/2

Abstract: PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2
Contextual Info: PA-SOD-1603-D250-xx/2 Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.

Enplas OTS

Abstract: Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16SD-03 16/Enplas ots-16-1.27-03
Contextual Info: PA-SOD-1603-D250-xx Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.

PA-SOD-2006-D310-08/2

Abstract: PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2
Contextual Info: PA-SOD-2006-D310-xx/2 Data Sheet 8-20 pin SO socket/8-20 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

PA-SOD-2806-D470-14/2

Abstract: PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2
Contextual Info: PA-SOD-2806-D470-xx/2 Data Sheet 8-28 pin SO socket/8-28 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

MM225-1A

Abstract: SC-527-8AA sc5278
Contextual Info: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS

Contextual Info: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM

Contextual Info: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.

S8GM-50-225B-6

Contextual Info: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.

Contextual Info: 8 PIN PLASTIC SOP 225 mil 8 5 detail of lead end P 4 1 A H F I G J S B C E D M L N K M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.)

P8GM-50-300B-4

Contextual Info: Mounting Pad Packing Name Magazine PB-98 MM300-04A 8 pin SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

fp-20-1.27-06

Abstract: 20 pin zif socket 20 pin zif connector PA-SOD-2006-16 enplas Sd pcb so package 2006-XX 20sd06 sd06
Contextual Info: PA-SOD-2006-xx Data Sheet 8-20 pin SO socket/20 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be

28 pin zif socket 1.27mm pitch

Abstract: 2808 transistor transistor 2808 SOd28 D420 enplas Sd pcb FP-28-1 PA-SOD-2808-18 Enplas to
Contextual Info: PA-SOD-2808-xx Data Sheet 8-28 pin SO socket/28 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 7.4mm - 7.9mm and lead pitch of 1.27mm can be

PIC1670

Abstract: vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665
Contextual Info: MICROCHIP TECHNOLOGY INC 22E D t.lG3501 OOQMTlfl 5 • -0 & M ic r o c h ip 8 Bit Microcontroller FEATURES PIN CONFIGURATION 40 Lead Dual In Line 1024 x 13-bit Program ROM 64 x 8-bit RAM 16 special purpose registers Arithmetic Logic Unit Sophisticated interrupt structure