8 PIN LEAD SOP Search Results

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC To Top / Package Lineup / Package Index FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215)

8 pin lead sop

Abstract: FPT-8C-A01 272 8pin fpt-8c
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002) TYP 5.40(.213) TYP 3.80(.150) TYP

FPT-8P-M02

Abstract: weight of SOP package
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M02 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight

TSSOP 8PIN MARK 21

Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II

PA-SOD-1603-D250-08/2

Abstract: PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2
Contextual Info: PA-SOD-1603-D250-xx/2 Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.

PA-SOD-2006-D310-08/2

Abstract: PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2
Contextual Info: PA-SOD-2006-D310-xx/2 Data Sheet 8-20 pin SO socket/8-20 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

SOD2808-2

Contextual Info: PA-SOD-2808-D420-xx/2 Data Sheet 8-28 pin SO socket/8-28 pin SO Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 7.4mm - 7.9mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

PA-SOD-2806-D470-14/2

Abstract: PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2
Contextual Info: PA-SOD-2806-D470-xx/2 Data Sheet 8-28 pin SO socket/8-28 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.

MM225-1A

Abstract: SC-527-8AA sc5278
Contextual Info: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS

Contextual Info: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM

Contextual Info: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.

S8GM-50-225B-6

Contextual Info: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.

P8GM-50-300B-4

Contextual Info: Mounting Pad Packing Name Magazine PB-98 MM300-04A 8 pin SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

PIC1670

Abstract: vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665
Contextual Info: MICROCHIP TECHNOLOGY INC 22E D t.lG3501 OOQMTlfl 5 • -0 & M ic r o c h ip 8 Bit Microcontroller FEATURES PIN CONFIGURATION 40 Lead Dual In Line 1024 x 13-bit Program ROM 64 x 8-bit RAM 16 special purpose registers Arithmetic Logic Unit Sophisticated interrupt structure

Contextual Info: Mounting Pad Packing Name Magazine PB-98 MM300-04A 14 pin SOP 300 mil 14 8 P detail of lead end 1 7 A H J E K F G I B C D M L N M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

MM225-05A

Abstract: S14GM-50-225B MM225-1A
Contextual Info: Packing Magazine Name MM225-1A MM225-05A Mounting Pad 14 pin SOP 225 mil 14 8 P detail of lead end 1 7 A H I E K F G J N C D M L B M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 14 PIN PLASTIC SOP 300 mil 14 8 P detail of lead end 1 7 A H J E K F G I B C D M L N M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 10.46 MAX. 0.412 MAX.

Contextual Info: 16 PIN PLASTIC SHRINK SOP 225 mil 16 9 P detail of lead end 1 8 A H J E K F G I B C L N D M M NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 5.50 MAX.

P16GM-50-300B-4

Contextual Info: Packing Name Mounting Pad Magazine PB-98 MM300-04A 16 pin SOP 300 mil 16 9 P detail of lead end 1 8 A H J E K F G I C N D M B L M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 16 PIN PLASTIC SOP 375 mil 16 9 detail of lead end P 1 8 A F H I G J S D M L B C N K M S E NOTES 1. Controlling dimension ITEM millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

P16GM-65-225B-2

Abstract: MM225-1A
Contextual Info: Packing Magazine Name MM225-1A Mounting Pad 16 pin Shrink SOP 225 mil 0.08 g 16 9 P detail of lead end 1 8 A H J E K F G I B C L N D M M NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.

APM4412

Abstract: 27BSC APM4412K STD-020C DSA0041352
Contextual Info: APM4412K N-Channel Enhancement Mode MOSFET Pin Description Features • 30V/12A, RDS ON = 9mΩ (typ.) @ VGS = 10V RDS(ON) =12mΩ (typ.) @ VGS = 4.5V • • • • Super High Dense Cell Design Reliable and Rugged Top View of SOP − 8 SOP-8 Package Lead Free Available (RoHS Compliant)