8 LEADS PACKAGE Search Results

MO-048

Abstract: MULTIWATT die TH17023
Contextual Info: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach

lm 3090

Abstract: HLMP-3200 XC-30211 L-285 LM 3466 HLMP-3201 HLMP-3350 HLMP-3351 HLMP-3365 HLMP-3366
Contextual Info: Package Style Part Number • • T1J4 Low Profile .020 Sq. Leads A M ‘ ii i r Du ii u D = .1 8 5 4,70 L = .230 (5,84) T1 'A Low Profile .020 Sq. Leads r \ id Wu u Plastic Lens Type r \ fj bT 11U H D = . 190 (4,83) L = .28 5 (7,24) T1 % Flangless Low .020 Sq. Leads

Contextual Info: PCI D ata Sheet Fast Or b - 50 Amp Avalanche AUTOMOTIVE RECTIFIERS Semiconductor Mechanical Dimensions Options - A dd Suffix to Part #: FR5028 F R 50 2 8 L = 2 Leads For 1 Lead Small Pkg: FR 5028C = Lead On Cathode FR 50 2 8 A = Lead On Anode Leads 1.00 typ. .05Dla.

751AZ-01

Abstract: SOIC-150-8
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8 CASE 751AZ−01 ISSUE O DOCUMENT NUMBER: STATUS: 98AON34918E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SOIC150 8 LEADS http://onsemi.com

IHA-104

Contextual Info: IHA www.vishay.com Vishay Dale Filter Inductors, High Current, Axial Leaded FEATURES • • • • Printed circuit mounting axial leads Pre-tinned leads Low cost construction Protected by polyolefin tubing - flame retardant UL type VW-1 per MIL-I-23053/8, class 3

IHA-101

Abstract: IHA-104 IHA-105
Contextual Info: IHA Vishay Dale Filter Inductors, High Current, Axial Leaded FEATURES • • • • Printed circuit mounting axial leads Pre-tinned leads Low cost construction Protected by polyolefin tubing - flame retardant UL type VW-1 per MIL-I-23053/8, class 3 requirements

Contextual Info: EH1325HSTTS-69.632M-CL125 EH13 25 HS RoHS Pb T TS -69.632M - CL125 Series RoHS Compliant Pb-free 3.3V 8 Pin DIP Metal Thru-Hole LVCMOS High Frequency Oscillator Cut Leads Cut Leads to 3.175 ±0.500 (0.125" ±0.020") Value Added Option Prefix Frequency Tolerance/Stability

Contextual Info: EH1100HSETTS-10.000M-CL150 EH11 00 HS ET RoHS Pb TS -10.000M - CL150 Series RoHS Compliant Pb-free 5.0V 8 Pin DIP Metal Thru-Hole HCMOS/TTL High Frequency Oscillator Cut Leads Cut Leads to 3.810 ±0.500 (0.150" ±0.020") Value Added Option Prefix Frequency Tolerance/Stability

Contextual Info: EH1100HSTS-125.000M-CL125 EH11 00 HS RoHS Pb TS -125.000M - CL125 Series RoHS Compliant Pb-free 5.0V 8 Pin DIP Metal Thru-Hole HCMOS/TTL High Frequency Oscillator Cut Leads Cut Leads to 3.175 ±0.500 (0.125" ±0.020") Value Added Option Prefix Frequency Tolerance/Stability

Contextual Info: EH1145HSETTS-81.360M-CL125 EH11 45 HS ET RoHS Pb TS -81.360M - CL125 Series RoHS Compliant Pb-free 5.0V 8 Pin DIP Metal Thru-Hole HCMOS/TTL High Frequency Oscillator Cut Leads Cut Leads to 3.175 ±0.500 (0.125" ±0.020") Value Added Option Prefix Frequency Tolerance/Stability

Contextual Info: EH1345HSETTTS-20.000M-CL175 RoHS Pb EH13 45 HS ET T TS -20.000M - CL175 Series RoHS Compliant Pb-free 3.3V 8 Pin DIP Metal Thru-Hole LVCMOS High Frequency Oscillator Cut Leads Cut Leads to 4.445 ±0.500 (0.175" ±0.020") Value Added Option Prefix Frequency Tolerance/Stability

jedec MS-012

Abstract: MS-012BA jedec MS-012-AC MS-012 Package jedec MS-012-AA jedec MS-013 28 MS-013 Package MS-012AA MS-012AC MS-013
Contextual Info: PACKAGE OUTLINES PLASTIC SMALL OUTLINE PACKAGE SOIC 3.9 mm width (narrow), 8 leads Package Designator: L (Reference MS-012AA) 6.20 .419 5.80 .393 0.25 [.010] M B M 5.00 .197 4.80 .189 A 8º 0º B 8 0.25 .010 0.17 .007 A 1 4.00 .157 3.80 .150 1.27 .050 0.40 .016

an 80171

Contextual Info: .86 [ 2 1 . 8 4 ] 9 0 ’ . 0 8 8 y_L [ 2 . 2 4 ] \ .0 9 [2 .2] B B .120 • [ 3 . 0 5 ] MIN. NOTES: 1. 2. Dimensions are inches & [m m ]. For oth e r dim ensions and inform ation on with unform ed leads, see package DQ. this package TOLERANCES - UNLESS OTHERWISE SPECIFIED

EQXO-2100UM-GW

Contextual Info: EURO QUARTZ EQXO-2000GW Series 8 pin Dual-in-Line Gull-Wing Clock Ocillators 8 pin DIL package with 'Gull-Wing' leads for SMD use Wide frequency range 20kHz to 160MHz Choice of supply voltage 3.3 Volts or 5.0 Volts DC Hermetically sealed package for reliability and low ageing

SM-8 Package

Abstract: e4 sot223 NPN/PNP transistor sot223 ZHB6718 ZHB6718 TYPICAL APPLICATION ZHB6790 ZHB6792
Contextual Info: H-Bridge devices in SM-8 Package 4 3 6 B2 2 B4 B1 E2,E3 1 C3,C4 7 E1,E4 8 C1,C2 5 The SM-8, is an 8 lead version of the industry standard SOT223 package. The package and leads occupy an area of 6.7 x 7.3mm and with a maximum height of 1.7mm it is ideal for space critical applications.

pmfp

Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Contextual Info: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

Contextual Info: - LTR REVISION DATE RELEASED APPD 0 8 -0 7 -0 0 NOTES: 1. 2. 3. 4. ALL DIMS ARE TO LERAN C E IS LEAD SPACING LEADS TO BE REQ U IREM EN TS 5. M ANUFACTURE IN INCHES M ILLIM ETERS . + . 0 1 0 ” ( ± 0 . 2 5 m m ) U N LESS OTHERW ISE SPECIFIED. IS MEASURED W H ERE LEADS EMERGE FROM THE PACKAGE.

D 92 M - 03 DIODE

Abstract: D 92 M 03 DIODE
Contextual Info: Vishay Telefunken Contents of a DH Diode in Package D041 Leads, tinned 85.7% 62.7%iron 27.8%copper 8 .8 % nickel 0.4% tin 0 .2 % lead 0.1% CuO Traces of Ag Package glass (14.3%) 62.9%PbO 27.4% Si02 7.7% K20 0.7% Na20 Total weight 310 mg 0.7% a i 2o 3 0 .6 % BaO

Contextual Info: Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads E SOT115Y N1 N2 D S2 Z p M M1 M2 A2 1 2 3 4 5 7 8 9

Contextual Info: Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads SOT115T N D N1 E S2 Z N2 p M M1 M2 A2 1 2 3 4 5 7 8 9 A S1 L F S W

Contextual Info: Package outline HSO8: plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad SOT786-3 D A E X c y exposed die pad HE v A Dh Z 8 5 Q A2 A1 pin 1 index 1 Lp bp w 5 mm scale Dimensions mm are the original dimensions Unit

Sprague 510

Contextual Info: MODEL PA15 Encoders 3/8" [9.52mm] Square, Sealed FEATURES • Miniature package for design flexibility. • Long operating life. • Conductive Plastic element. • Bushing or PC board mount. ELECTRICAL SPECIFICATIONS ENVIRONMENTAL SPECIFICATIONS Output: 2-bit gray code, Channel A leads Channel B

D-16

Abstract: S-14 TO-251L TO253
Contextual Info: Package Information Plastic DIP, 8-16 Leads E 1 E1 2 D S A2 A1 A L e c b1 b Q e1 Dim Millimeters Min Max Inches Min Max A A1 A2 b b1 c D-8 D-14 D-16 E E1 e e1 L S-8 S-14 S-16 3.81 0.38 1.27 0.89 0.38 0.20 9.65 17.27 18.93 5.59 7.62 2.29 7.37 2.79 1.02 1.02

Contextual Info: ASP-16342-05 NOTES: , 0 0 0 0 0 0 0 0 1. USE A S P - 8 0 4 8 1 - 0 8 BODY FOR MOLED PAD & ALIGNMENT PIN. 2. LOCKING LEADS ON POST POS 10 & 11. o\ 3. PARTS TO BE PACKAGED IN TAPE & REEL. 4. R E P R E S E N T S 2 .2 0 5 5 6 m m A CRITICAL DIMENSION. REF