|
131-7118-11D
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
PDF
|
|
|
92417-118HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail. |
PDF
|
|
|
131-7118-21H
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
PDF
|
|
|
131-7118-11H
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
PDF
|
|
|
98426-S03-17-118LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch. |
PDF
|
|
