| 77311-427-33LF |  | Amphenol Communications Solutions | BergStikĀ®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. | PDF |  | 
| 77311-827-33LF |  | Amphenol Communications Solutions | BergStikĀ®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. | PDF |  | 
| 77311-127-33LF |  | Amphenol Communications Solutions | BergStikĀ®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. | PDF |  | 
| XPBL-2733B1-10D |  | Amphenol Communications Solutions | 25G BIDI SFP+ LR | PDF |  | 
| XPBL-2733B1-10DA |  | Amphenol Communications Solutions | 25G BIDI SFP+ LR I Temp | PDF |  |