|
L777HDA26PVF
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Pin, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
PDF
|
|
|
L777HRA26PVF
|
|
Amphenol Communications Solutions
|
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell+Grounding Dimplesl, 26 Pin, 4-40 Fixed Front Screwlock |
PDF
|
|
|
L777HRBH44P
|
|
Amphenol Communications Solutions
|
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 44 Pin, 4-40 Rear Nut |
PDF
|
|
|
L777HDB44POL2
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
PDF
|
|
|
L777HDEG15POL2RM8
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Pin, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
PDF
|
|
