7457 IC Search Results
7457 IC Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 54F193/BEA |
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54F193/BEA - Dual marked (M38510/34304BEA) |
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| PEF24628EV1X |
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PEF24628 - SOCRATES Four-channel SHDSL EFM system-on-chip |
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| ICM7555MTV/883 |
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ICM7555MTV/883 - Dual marked (5962-8950303GA) |
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| ICL8212MTY/B |
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Programmmable High Accuracy Voltage Detecor |
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| LM710CH |
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LM710 - Comparator, 1 Func, 5000uV Offset-Max, 40ns Response Time, BIPolar, MBCY8 |
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7457 IC Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
2 ao 565
Abstract: SC CONNECTOR DRAWING aesz
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OCR Scan |
PR022-Q1. Z35-7512 CT710079 2 ao 565 SC CONNECTOR DRAWING aesz | |
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Contextual Info: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 SAW APP’D. BY .635 [16.13] MAX B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
7188Sâ CT710065 | |
SS-7188S-A-NF-K1-50Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01. |
OCR Scan |
PR022-01. Z35-7512 CT710099 SS-7188S-A-NF-K1-50 | |
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Contextual Info: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 TRM APP'D. BY B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
OCR Scan |
PR022-01. CT710046 | |
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Contextual Info: - .708 [17.98] .850 [21.59] MAX.- -.635 [16.13] MAX.- DATE REV ECN 2/2/06 A4 7457 JM 3/21/06 A5 7549 TRM APP’D. BY ( .148 [3.75] ) • HIGHEST POINT OF BEAM J ~ \ — J~V I I t ( r ( .068 [1.73] ) B — .125 ±.010 [3.18 ±0.25] .155 [3.937] TYP. ( .016 [0.41] ) |
OCR Scan |
PR022-01. CT710025 | |
CT710025
Abstract: GL-006
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OCR Scan |
gl006 CT710025 CT710025 GL-006 | |
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Contextual Info: DATE REV ECN 2/2 /06 A2 7457 JM 3/21/06 A3 7549 SAW APP’D. BY • .850 [21.59] MAX ■ B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
CT710002 | |
NT 101Contextual Info: .100 [2.54] 3 DATE REV ECN APP'D. BY 2/2/06 A4 7457 JM .050 [1.27] (7) .050 [1.27] 0.035 [0.B9] ±.003 [OJOS] (fi) |-$H 0.005 [g.15]| , 0.062 [K57] ±.0D3 [O.ÜB] (Z )— ' f I4I0DQG [oTTsJI .125 [11B ] -fri 0.006 [0.Î5Ï1 | B P.C.B. RECOMMENDED HOLE LAYOUT |
OCR Scan |
Z35-7512 CT700020 NT 101 | |
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Contextual Info: DATE I— LO CN .100 [2.54] TYP. I— .050 [1.27] TYP. REV ECN 2/2 /06 A1 7457 JM 4/4 /06 A2 7557 TRM APP’D. BY O .050 [1.27] 0.035 [0.89] ±.0 0 3 [0.08] 10 $ 0.006 [0.15] 4- 4- 4 - PIN #1 ,.128 [3.25] -e — 0.062 [1.57] ±.003 [0.08] (2) $ .080 [2.03] |
OCR Scan |
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Contextual Info: in DATE REV ECN 2/2 /06 A1 7457 JM 4/3 /06 A2 7557 TRM APP'D. BY m B cm o. o O CD o o + r NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
PR022-01. 2002/95/ECÃ | |
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Contextual Info: DATE — 0.035 [0.89] ±.003 [0.08] 8 U .050 [1.27] REV ECN 2/2 /06 C1 7457 JM 3/21/06 C2 7549 SAW APP’D. BY TYP .050 [1.27] — .100 [2.54] TYP CO ro «HH*- •125±.010 -.375 [9.53] (3.17±0.25 565 [14.35] P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE |
OCR Scan |
PR022-01. CT710073 | |
ME 738Contextual Info: DATE REV ECN APP’D. BY 2/2/06 A3 7457 JM 3 -30 -0 6 A4 7557 TRM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
OCR Scan |
PR022-01. CT700019 ME 738 | |
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Contextual Info: — DATE REV ECN 2/2 /06 A1 7457 JM 3/21/06 A2 7548 TRM APP'D. BY .100 [2.54] TYP. - - . 0 5 0 [1.27] TYP. .050 [1.27]1.035 [0.89] ±.0 0 3 [0.08] 8 - [. ] 0.006 0 15 PIN #1 • .128 [3.25] .125 [3.18] 0.006 -e (2) [ 0.15] .450 [11.43] P.C.B. RECOMMENDED HOLE LAYOUT |
OCR Scan |
PR026-01. CT710081 | |
122DContextual Info: J — Ü : DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM *1.254 [3 1.85] MAX — B tn ^ IfÖ T T T NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC U L 9 4 V - 0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
PR022-01. Z35-7512 CT710044 122D | |
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Contextual Info: DATE REV ECN 2/2 /06 A1 7457 JM 3/21/06 A2 7549 SAW APP’D. BY .635 [16.13] MAX l ' ai PO NOTES: K1 KEYWAY 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
CT710099 | |
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Contextual Info: DATE REV 2/2 /06 ECN A4 7457 JM 3 -3 0 -0 6 A5 7557 TRM APP’D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
OCR Scan |
CT700020 | |
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Contextual Info: DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM - *3.454 [B7.7¿]MAX • -*3.512 [89.20]- — j h - *.140 [3.7S] {1fi> B .000 TOP OF PCB TO BOTTOM OF OPENING -| |— -55D [1.3-97] REF TYP -.010 MAX. RADIUS(4) SUGGESTED PANEL OPENING -*J.2DÖ [S1JZB]- NOTES: BOTÏÏ1M SURFACE OF JACK(PCB SURFACE) |
OCR Scan |
CT710046 | |
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Contextual Info: ^ LO DATE REV ECN 2/2/06 A2 7457 JM 3/24/06 A3 7557 TRM APP'D. BY 10 CN O .o . B o O o + o Cvj r To' J= C NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
OCR Scan |
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ss-7188s-a-flsContextual Info: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B -*.72D [18.02] M A X — *.635 [16.13] MAX — NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: ,0+0 [ 1 . 0 Z ] H — COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
PR022-D1. Z35-7512 CT710002 ss-7188s-a-fls | |
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Contextual Info: 2 DATE REV ECN 2/2/06 A7 7457 JM 3 -2 4 -0 6 A8 7557 TRM APP'D. BY BOTTOM SURFACE OF JACK PCB SURFACE .738 [18.74] MAX.-0.035 [0.89] ± .0 0 3 [0.08] (8) - ( .148 [3.75] ) TO HIGHEST POINT OF BEAM £ B P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE |
OCR Scan |
PR022-01. CT700015 | |
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Contextual Info: DATE REV ECN 2/2 /06 A2 7457 JM 3/2 0/06 A3 7548 TRM APP’D. BY .523 [13.28] MAX B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 .350 [8.89] CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .050 [1.27]— TYP. SEE CHART FOR PART NUMBER |
OCR Scan |
PR022-01. CT710060 | |
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Contextual Info: DATE REV ECN APP'D. BY 2/2/06 Cl 7457 JM ,1Z5±,010 B *.6 4 n M AX .670 MAX 17.02 NOTES: 1. CONNECTOR MATERIALS: HOUSING: ( I1 5 ± a . 3 B ) THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
OCR Scan |
PR022-01. Z35-7512 CT710073 | |
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Contextual Info: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 SAW 5 -3 -0 6 A5 7608 TRM APP'D. BY 4.554 [115.67] MAX B X c oo .550 [13.97] TYP LO •'Ñh LO NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN |
OCR Scan |
PR022-01. CT710019 | |
1B92
Abstract: draino
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OCR Scan |
PR022-01. Z35-7512 CT710Q15 1B92 draino | |