7456 I. C Search Results

SS-6866B-FLS-C40

Abstract: SS6866BFLSC40 pcb MOUNT F JACK CONNECTOR pcb MOUNT JACK CONNECTOR
Contextual Info: DATE REV ECN 2/1/06 A2 7456 JM 10-23-09 A3 8851 TRM APP’D. BY .040 [1.02] 5 — -.028 [.71] (6) MM mm i i i i i _L LO O CSJ i i r B B • — .400 [10.16]- ■] .028 [0.71] MINIMUM PCB THICKNESS P.C.B. RECOMMENDED HOLE LAYOUT SEEN FROM COMPONENT SIDE

Contextual Info: REV ECN 2/1/06 DATE A2 7456 JM 1 0 -2 3 -0 9 A3 8851 TRM APP’D. BY .040 [1.02] 5 — -.0 28 [.71] (6) i i i i i i lO o mm i H i i i i i in o ro -.4 00 [10.16].028 [0.71] MINIMUM PCB THICKNESS .100 [2.53] ±.010 [0.25] — n .050 [1.27] (2) — -| — P.C.B. RECOMMENDED HOLE LAYOUT

Contextual Info: 2 DATE REV. ECN A P P ' D BY 2-2-06 A2 7456 JM 7-7-06 A3 7671 TRM *{.448 [ I I .38] PORT SPA C IN G NOTES: - TOLERANCES COMPLY WITH F . C . C . D IM E N S IO N REQUIREMENTS ALL OTHERS ± . 0 0 5 [ 0 . I 3 ] UNLESS OTHERWISE SPECIFIED. - D I M E N S I O N S SHOWN W I T H

448-I

Contextual Info: 2 DATE REV. ECN AP P ' D BY 2-2-06 A2 7456 JM 7-7-06 A3 7671 TRM — «1 , 0 0 8 ± . 0 I0 - [ 2 5 . 6± 0 . 2 5 ] nnnni * 1. 0 8 1 [27.46] * .448 [ I 1.38] PORT S P A C I N G NOTES: - TOLERANCES COMPLY WITH F . C . C . D IM E N S IO N REQU IREMENTS ALL OTHERS ± . 0 0 5 1 0 . 1 3 ] UNLESS OTHERWISE

Contextual Info: 6 5 APPROVED: D A T E :_ TITLE: B SPECIFICATIONS: Material: Insulator: PBT, rated UL 9 4 V -0 Insulator color: Black Plating: Contacts: Brass, Tin plated Screws: Steel, Nickel plated Hardware: Brass, Tin plated Electrical: Operating voltage: 300 VAC max.

Contextual Info: www.teleqqertner.com LerchenstraBe 35 Germany Phone: +49 7157 125-0 Fax: +49 7157 125-120 Anschlußmaße nach IEC 1 6 9 -1 7 / mating face according to IEC 1 6 9 -1 7 D—71144 Steinenbronn Außenleiter / outer conductor Innenleiter / inner conductor Crimprohr / crimp ferrule

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A2 74-56 JM .050 [1.27] 2 — I B -*1.744 [44.30]Ln f in -.135 [3.43] (2) NOTES: T 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

cd 9094

Contextual Info: Anschlußmaße nach IEC 1 6 9 -1 7 / mating face according to E C 1 6 9 -1 7 CD CNI 2 5 ± 0 .5 2 0 ± 0 .5 OO CVl I CO /l TVs Telefax 07157/125-120 io ö -H CN CO in -H CO Lerchenstrasse 35 Telefon 07157/125-0 9B m o ö -H •rn K.Gättner GmbH 71144 Steinenbronn

CT660056

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 B2 74-56 JM s t-n B .550 [13.97] REF TYP S “W T T -*1.35D [39.37]- NOTES: 1. CONNECTOR MATERIALS: QO HOUSING: CED LT> THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: K> COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

b731

Abstract: fox - 1h FRA 11118 2B50
Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A2 74-56 JM .050 [1-27] 2 — I B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94- V-0 CONTACTS/SHIELD: It COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

micro sd connector

Contextual Info: DATE REV ECN APP'D. BY 2 /1 /0 6 A2 74-56 JM -*2231 [59.36] MAX- H -.448 [11.38] REF TYP B 3 i^ i - LTD O 1 O 1- 1 1-« LH LD OO |——.135 [143] 2 NOTES: 1. CONNECTOR MATERIALS: HOUSING: + H -+ + THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY

84ir

Contextual Info: DATE REV ECN APP'D. BY 2 / 1/06 B2 74-56 JM s ►i .550 [13.97] REF TYP Í B § NOTES: uO 1. CONNECTOR MATERIALS: g HOUSING: I 1 THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: TKII^ IjSS Crystal Oscillator FXO-31F clock Crystal Oscillator •4# fi/Feature •t ? ; y ? H40.000 • KSS 7C ]j • > ? 7 ' f X h ' U - K<7)'h • m t T \ is s is fm • ')y a-UA,tzitli^mvto • CMOS, TTL IC L U n g -ft^ C M O S • IC ftK c D T lc JI

U2 z54

Contextual Info: rmilmi lililí m ili m \\\\m\ DATE REV ECN APP'D. BY 2/1/06 D3 74-56 JM - *2,354 [5 9.79] MAX- - B mtrn NOTES: ~ f UT1 1. CONNECTOR MATERIALS: CXI o HOUSING: O THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: CD COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

Contextual Info: DUAL MATCHED MMIC AMPLIFIERS HIGH DYNAMIC RANGE 50Ω DC to 4 GHz MERA-556 MERA-7456 MERA-533 MERA-7433 all specifications at 25°C J GAIN , dB Typical A1, A2 FREQ. GHz MODELu NO. MERA-533 MERA-556 MERA-7456 MERA-7433 0.1 fL - fU over frequency, GHz 1 2 3

TB-294

Abstract: PL-164 DL1020
Contextual Info: DUAL MATCHED MMIC AMPLIFIERS HIGH DYNAMIC RANGE 50Ω DC to 4 GHz MERA-556 MERA-7456 MERA-533 MERA-7433 all specifications at 25°C J MAXIMUM DYNAMIC VSWR MAXIPOWER dBm RANGE MUM (:1) * IP3 Typ. RATING Output GAIN , dB Typical FREQ. GHz MODELu NO. 0.1 fL - fU

74LS362

Abstract: sn 7456 sn 7455 TTL 7455 sn74ls362
Contextual Info: TYPES SNS4LS3S2, SH74LS352 DUAL 4-UME-T0-1-LIME DATA SELECTORS/MULTIPLEXERS B U L L E T I N N O . O L -S 7 1 2 4 8 3 , O C T O B E R 1976 SN64LS3S2 . . . J OR W PACKAGE SN 74L83S2 . . . J OR N PACKAGE (TOP VIEW Inverting Versions of SN54 LSI53, SN74LS153

UMI-4A-STEP-68

Abstract: Quadrature Encoder 4 axis micro-step stepper motor driver idc motion Quadrature Encoder
Contextual Info: Stepper Motor Control for PXI and CompactPCI PXI-7314 and PXI-7324 1-4 Axis independent or coordinated multi-axis motion contol Microprocessor based to offload the host CPU CompactPCI bus for fast command transfer Open or closed loop control versions Point-to-point motion

183285-02

Abstract: HS488 TNT4882C P1386 021097
Contextual Info: High-Performance GPIB Interface for PCI Mezzanine Bus PMC-GPIB Features TNT4882C ASIC Complete IEEE 488.2 Controller compatibility FIFO buffers to de-couple GPIB transfers from PMC transfers GPIB monitor port for board and bus-level diagnostics Complete in-system functional

5347B

Abstract: EN 6100-4-2 10E-02 AT77C104B AT77C104B-CB08V
Contextual Info: Features • • • • • • • • • • • • • • Thermal Sensitive Layer Over a 0.35 µm CMOS Array Image Zone: 0.4 x 11.6 mm Image Array: 8 x 232 = 1856 Pixels Pixel Pitch: 50 × 50 µm = 500 dpi Resolution On-chip 8-bit Analog to Digital Converter

atmel 0750

Abstract: 5347A block diagram of fingerprint sensor CMOS image sensor fingerprint circuit diagram of fingerprint sensor
Contextual Info: Features • • • • • • • • • • • • • • Thermal Sensitive Layer Over a 0.35 µm CMOS Array Image Zone: 0.4 x 11.6 mm Image Array: 8 x 232 = 1856 Pixels Pixel Pitch: 50 x 50 µm = 500 dpi Resolution On-chip 8-bit Analog to Digital Converter

PXI-8220

Contextual Info: 2-Slot PC Card PCMCIA Carrier for PXI PXI-8220 2-Slot PCMCIA adapter in one PXI slot – Supports 2 Type-I/II Cards or 1 Type-III Card – Supports 5 V and 3.3 V PCMCIA Cards PCI interface for maximum performance Serialized IRQ in PXI supports legacy ISA style interrupts

HS488

Abstract: TNT4882C
Contextual Info: High-Performance GPIB Interface for Compact PCI CPCI-GPIB Features TNT4882C ASIC Complete IEEE 488.2 Controller compatibility FIFO buffers to de-couple GPIB transfers from CompactPCI transfers GPIB monitor port for board and bus-level diagnostics Complete in-system functional testing

PCI-DIO-96

Abstract: 182762-0R5 777387-01 182762-02 182762-01 82C53 82C55A CB-50LP PCI-DIO PCIDIO96
Contextual Info: Digital I/O Board for PCI PCI-DIO-96 Features Digital I/O 96 TTL lines in 8-bit ports Unidirectional and bidirectional I/O 2-wire handshake capability Hardware architecture MITE PCI bus-master interface NI-DAQ Software Windows NT Windows 95 Windows 3.1