7448 IC Search Results
7448 IC Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 54F193/BEA |
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54F193/BEA - Dual marked (M38510/34304BEA) |
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| PEF24628EV1X |
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PEF24628 - SOCRATES Four-channel SHDSL EFM system-on-chip | |||
| ICM7555MTV/883 |
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ICM7555MTV/883 - Dual marked (5962-8950303GA) |
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| ICL8212MTY/B |
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Programmmable High Accuracy Voltage Detecor |
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| LM710CH |
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LM710 - Comparator, 1 Func, 5000uV Offset-Max, 40ns Response Time, BIPolar, MBCY8 |
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7448 IC Price and Stock
Wurth Elektronik IC-744888Power Management IC Development Tools Demo Board Gleanergy Demonstration Kit |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IC-744888 |
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Get Quote | ||||||||
7448 IC Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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7449 BCD to 7-segment
Abstract: TTL 7448 7 segment with 7448 7449 "BCD to 7-segment" truth table for 7448 LM 7448 7449 DECODER 7448 decoder 7448 PIN OUT 7448 bcd to seven segment decoder
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 B5 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .040 [1.02]— SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA — SEE CHART FOR PART NUMBER |
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PR022-01. | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 C1 7448 JM -*.610 [16.51] MAX- STEW'ART PATENTED B B 3s NOTES: — 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
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PR022-01. CT640044 | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A2 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — .050 [1.27] TYP TOL NON-ACCUM — .025 [0.64] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
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PR022-01. | |
powerpc 7448
Abstract: M1G9
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PC7448 MPx/60x 64-bit 36-bit Hz/166 0814C powerpc 7448 M1G9 | |
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Contextual Info: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V) |
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PC7448 MPx/60x 64-bit 36-bit 0814Fâ | |
M tronContextual Info: DATE REV ECN APP’D. BY 1/24/06 B4 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER RMK4 KEY — |
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PR022-01. CT640007 M tron | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 B1 7448 JM ALL OPEN AREAS TO BE SONIC WELD SEALED B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
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T630009 | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A5 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .040 [1.02] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
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CT640014 | |
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Contextual Info: DATE REV ECN APP'D. BY 1/24/06 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .050 [1.27] TYP TOL NON-ACCUM — |
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S 7448Contextual Info: DATE REV ECN APP'D. BY 1 /2 4 /0 6 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER ro o> O |
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PR022-01. CT640021 S 7448 | |
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Contextual Info: DATE REV ECN APP'D. BY 1/24/06 C2 7448 JM B NOTES: — 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .050 [1.27] TYP TOL NON-ACCUM — SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .025 [0.64] |
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PR022-01. CT640013 | |
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Contextual Info: DATE REV ECN APP'D. BY 1/24/06 B6 7448 JM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY CNJ co CN .040 [1.02] SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER |
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PR022-01. CT640091 | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 C2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER .040 [1.02] |
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PR022-01. CT640005 | |
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Contextual Info: DATE REV ECN APP'D. BY 1/24/06 AO 7448 JM B B -H ocT N0TES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER — |
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CT640125 | |
CI 7448
Abstract: 7448 layout of 7448 ss-6366
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PR022-01. CT630011 CI 7448 7448 layout of 7448 ss-6366 | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A1 7448 JM B B NOTES: — > — 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01. .050 [1.27] TYP TOL NON-ACCUM — .025 [0.64] 0.035 [0.89] 6 gr 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY |
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PR022-01. CT640025 | |
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Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A4 7448 JM B B —— *.635 [16.13] MAX— NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY 08277204 SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
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PC7448
Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
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PC7448 MPx/60x 64-bit 36-bit Hz/166 0814D microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448 | |
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Contextual Info: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V) |
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PC7448 MPx/60x 64-bit 36-bit Hz/166 0814G | |
PC7448
Abstract: powerpc 7448 LGA PACKAGE thermal resistance Freescale powerpc 750 dhrystone
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PC7448 MPx/60x 64-bit 36-bit Hz/166 0814H PC7448 powerpc 7448 LGA PACKAGE thermal resistance Freescale powerpc 750 dhrystone | |
ic 7448
Abstract: 7448 ic 7448 p ic of ic 7448 IC 7448 in
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PR022-01. CT640142 ic 7448 7448 ic 7448 p ic of ic 7448 IC 7448 in | |
A111Contextual Info: DATE REV ECN APP'D. BY 1/24/06 AO 7448 JM B B -— *.735 [18.67] MAX— - — *.635 [16.13] MAX— I NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA |
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PR022-01. CT640120 A111 | |
lem lt 100 p
Abstract: lem 50 p
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PR022-01. CT640014 lem lt 100 p lem 50 p | |