| 87827-116HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch. | PDF |  | 
| 79257-116HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 95157-116VLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 131-7116-11D |  | Amphenol Communications Solutions | Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. | PDF |  | 
| 95157-116TB07LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. | PDF |  |