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75970-8AU-02LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch. | 
PDF
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| 
75970-8AP-02LF
 | 
 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch. | 
PDF
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 | 
| 
75970-8AP-04LF
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 | 
Amphenol Communications Solutions
 | 
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,4 Positions, 2.54 mm (0.100in) Pitch. | 
PDF
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75970-8AM-10LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,10 Positions, 2.54 mm (0.100in) Pitch. | 
PDF
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TMP708AIDBVR
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Texas Instruments
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Resistor-Programmable Trip Point Temperature Switch 5-SOT-23 -40 to 125 | 
 
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