68-JLCC PACKAGE Search Results

Contextual Info: HANBit HMF51232J4 FLASH-ROM MODULE 2MByte 512K x 32-Bit – 68-Pin JLCC Part No. HMF51232J4 GENERAL DESCRIPTION The HMF51232J4 is a high-speed flash read only memory (FROM) module containing 524,288 words organized in a x32bit configuration. The module consists of four 512Kx 8 FROM mounted on a 68 -pin, JLCC FR4-printed circuit board.

Contextual Info: HANBit HMF51232J4V FLASH-ROM MODULE 2MByte 512K x32-Bit – 68-Pin JLCC Part No. HMF51232J4V GENERAL DESCRIPTION The HMF51232J4V is a high-speed flash read only memory (FROM) module containing 524,288 words organized in a x32bit configuration. The module consists of four 512Kx 8 FROM mounted on a 68-pin, JLCC FR4-printed circuit board.

68PIN

Abstract: max4860
Contextual Info: HANBit HMF4M16J4V Flash-ROM Module 8MByte 4Mx16bit , 68-pin JLCC type, 3.3V Design Part No. HMF4M16J4V GENERAL DESCRIPTION The HMF4M16J4V is a high-speed flash read only memory (FROM) module containing 2,097,152 words organized in an x16bit configuration. The module consists of four 2M x 8bit FROM mounted on a 68-pin, JLCC connector FR4-printed circuit

EP1210D

Abstract: EP320D ep1800g EP320P EP1800L EPS448D EP6000 EP900D
Contextual Info: EP ID PACKA6E PIHS MACRO CELLS IREGISTERS BURIED REGISTERS INPUTS I/O M Hz Imix Icc mA STANOBY Icc mA EP1800J EP1800L EP1800G JLCC PLCC PGA 68 68 68 48 48 48 16 16 16 16 16 16 48 48 48 25.0 25.0 25.0 30.0 30.0 30.0 0.15 0.15 0.15 EP1210D EP1210P EP1210J EP1210L

sram 1mbyte 3.3v

Abstract: HMS25632J2V 256KX
Contextual Info: HANBit HMS25632J2V SRAM MODULE 1Mbyte 256K x 32-Bit 3.3V, 68-Pin JLCC Packaging Part No. HMS25632J2V GENERAL DESCRIPTION The HMS25632J2V is a high-speed static random access memory (SRAM) module containing 262,144 words organized in a x32-bit configuration. The module consists of two 256K x 16 SRAMs mounted on a 68-pin, double-sided, FR4-printed circuit

HMS51232J4V

Abstract: marking HX 6 pin KXY 23
Contextual Info: HANBit HMS51232J4V HAN SRAM MODULE 2Mbyte 512Kx32Bit , 68-Pin JLCC Packaging,3.3V BIT Part No. HMS51232J4V GENERAL DESCRIPTION The HMS51232J4V is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4printed circuit board.

HMS51232J4

Contextual Info: HANBit HMS51232J4 SRAM MODULE 2Mbyte 512K x 32-Bit , 68-Pin JLCC Packaging Part No. HMS51232J4 GENERAL DESCRIPTION The HMS51232J4 is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4-printed circuit board.

HMS25632J2

Contextual Info: HANBit HMS25632J2 SRAM MODULE 1Mbyte 256K x 32-Bit , 5V, 68-Pin JLCC Design Part No. HMS25632J2 GENERAL DESCRIPTION The HMS25632J2 is a high-speed static random access memory (SRAM) module containing 262,144 words organized in a x32-bit configuration. The module consists of two 256K x 16 SRAMs mounted on a 68-pin, double-sided, FR4-printed circuit

HMS51232J4A

Contextual Info: HANBit HMS51232J4A SRAM MODULE 2Mbyte 512K x 32-Bit , 68-Pin JLCC Packaging Part No. HMS51232J4A GENERAL DESCRIPTION The HMS51232J4A is a static random access memory (SRAM) module containing 524,288 words organized in a x32-bit configuration. The module consists of four 512K x 8 SRAMs mounted on a 68-pin, single-sided, FR4-printed circuit board.

128kx8

Abstract: EDI88130 32 PIN edi84256
Contextual Info: moi Selector Guide ELECTRONIC DESIGNS INC. Density Oraanization Part No. Speed ns Max Current (mAl Packaae Paae x32 Flash 4 Megabits 4 Megabits 128KX32 4 Megabits 4 Megabits 128KX32 128Kx32 EDI7C32128C-JM EDI7M32128C-GB 120-200 120-200 250 250 68 lead JLCC

Contextual Info: 512Kx32 3.3V SRAM MODULE ADVANCED* FEATURES • Commercial Temperature Range ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation: ■ TTL Compatible Inputs and Outputs • 3.3V ± 1 0% Po w er Supply ■ Fully Static Operation: ■ Packaging • 68-lead, JLCC/PLCC, Package 701

Contextual Info: m WS512K32-XCJX M/HITE M IC R O E L E C T R O N IC S 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15,17, 20, 25ns Two pinout options ■ Packaging • Standard commercial pinout M aster W E • 68 Lead, JLCC (Package 701) • G2 p in o u t fo r upgrade path to m ilita ry grad e d ev ices

Contextual Info: a WS512K32-XCJX WHITE /MICROELECTRONICS 512Kx32SRAM MODULE PRELIMINARY* FEATURES • ■ A ccess Tim es of 1 5 ,1 7 , 20, 25ns ■ T w o pino ut op tions Packaging • S tandard com m ercial pin o u t M a s te rW E • 68 Lead, JLCC (Package 701) • G2 pino ut fo r upgrade pa th to m ilita ry grade devices

jlcc 32 R

Abstract: 68-JLCC package
Contextual Info: ^EDI EDI8C32128C ELECTRONIC DESIGNS INC. • High Performance Four Megabit SRAM 128Kx32 CMOS High Speed Static RAM Features The EDI8C32128C, a high speed, high performance, four megabit density Static RAM organized as 128Kx32 bits, contains four 128Kx8 SRAM mounted in a package.

CERAMIC LEADLESS CHIP CARRIER LCC 68

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
Contextual Info: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Yamaichi IC51-0804-808

Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

LCS-68

Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

altera ep610

Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

44 pin jlcc socket

Abstract: QILE-84P-410T LCS-68 821575-1 84P-410T
Contextual Info: Selecting Sockets for J-Lead Packages A pplication Brief 46 M arch 1995, ver. 5 Introduction Altera offers ceramic and plastic J-lead chip carrier packages JLCC and PLCC for many devices to reduce the "real estate" demands of a system. These small packages are generally intended for surface mounting.

transistors BC 458

Abstract: BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA
Contextual Info: アルテラ・デバイス パッケージ・インフォメーション Altera Device Package Information Data Sheet 1998年 1 月 ver.7 イントロダク ション Data Sheet このデータシートにはアルテラのすべてのデバイス・パッケージに関する

LCS-68

Abstract: 821575-1 LCS-84 1-382320-7 821574-1
Contextual Info: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board