676 BGA Search Results

Contextual Info: Product Number: 587-10-676-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-005 26 X 26 # Of Pins Mill-Max Part Number 676 587-10-676-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

Contextual Info: Product Number: 599-10-676-13-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-001 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: Product Number: 599-10-676-13-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 676-13-000 26 X 26 # Of Pins Mill-Max Part Number 676 599-10-676-13-000429 RoHS Compliant LOOSE PIN:

VSC9111

Contextual Info: G56053-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9111. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV DQ LQWHJUDWHG 621 76'+ WUDQVSRUW RYHUKHDG WHUPLQDWLQJ WUDQVFHLYHU IRU XVH LQ 676670 DSSOLFDWLRQV 7KH GHYLFH FDQ EH XVHG WR FRPELQH IRXU 676670 RU  676

Contextual Info: Product Number: 599-11-676-13-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-001 26 X 26

Contextual Info: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000

Contextual Info: Product Number: 582-11-676-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-005 26 X 26

Contextual Info: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 676-13-000

Contextual Info: Product Number: 599-11-676-13-000428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-000 26 X 26

fg676

Abstract: 676-Pin bga pin 676
Contextual Info: R Package Drawings Ball Fine Pitch Packages - FG676 676-PIN FINE PITCH BGA FG676 11-62 August 12, 1999 (Version 1.4)

SF-BGA676C-B-41F

Contextual Info: 27.00mm [1.063"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 27.00mm [1.063"] Top View RoHS 25.00mm [0.984"] Ø 0.23mm [0.009"] ±0.0005" Side View 1.68mm [0.066"] 2 1 3 Description: Giga-snaP BGA SMT Foot 676 position male terminal pins to solder balls 1.0mm [0.039"] centers, 26x26 array

FF676

Abstract: 676-BALL
Contextual Info: R Flip-Chip BGA FF676 Package PK088 (v1.1) August 27, 2007 676-BALL FLIP-CHIP BGA (FF676) 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

FGG676

Abstract: fg676 PK035
Contextual Info: R PK035 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG676/FGG676) Package 676-BALL FINE-PITCH BGA, 1.00MM PITCH (FG676/FGG676) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

BGA package tray 40 x 40

Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09

VSC9142

Contextual Info: G56054-0, Rev 1.0 SONET/SDH 2.5Gbps Transport Terminating Transceiver VSC9142. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ

MS-034-AAL-1

Abstract: EF676
Contextual Info: 676 Ball Flip-Chip BGA EF676 Package PK375 (v1.0) May 26, 2009 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 (4X) D1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 PIN 1 I.D. 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF

ATM machine using microcontroller

Abstract: STS-48c VSC9112
Contextual Info: G56048-0, Rev 1.0 STS-48c Physical Layer Packet/ATM Over SONET/SDH Device VSC9112. 1.0 Product Description 1.1 Functional Overview 7KH 96& LV D GXDOPRGH 676F$8F 621 76'+ WR SDFNHW$70 IUDPLQJ GHYLFH ,Q WKH 326 SDFNHW RYHU 621(7 PRGH WKH GHYLFH FDQ EH XVHG LQ HTXLSPHQW LQWHUFRQQHFWLQJ

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

recommended layout CSG324

Abstract: CSG324 SPARTAN 6 UG385 spartan 6 LX150 XC6SLX4 2 CSG225 I XC6SLX4 CSG225 UG385 LX150 AB p89 LX100T
Contextual Info: Spartan-6 FPGA Packaging and Pinouts Advance [optional]Product Specification UG385 v1.0 June 24, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development

Contextual Info: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

Contextual Info: Product Specifications PART NO.: VL43B1G63A-K0/K9/F8/E7M REV: 1.0 General Information 8GB 1Gx72 DDR3 SDRAM ECC REGISTERED SO-RDIMM 204-PIN Description The VL43B1G63A is a 1Gx72 DDR3 SDRAM high density RDIMM. This dual rank memory module consists of eighteen CMOS 512Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, a 28-bit registered

CSG324

Abstract: transistor bl p89 bl p76 transistor transistor bl p85 XC6SLX150T spartan 6 LX150t bl p78 transistor CPG196 CSG484 xc6slx75csg484
Contextual Info: Spartan-6 FPGA Packaging and Pinouts Product Specification UG385 v1.2 February 22, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the