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    00-08-A

    Contextual Info: TpcmTM 670 TpcmTM 670DF Innovative Technology for a Connected World Tpcm 670 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of Intel mobile processors. Tpcm 670 is optimized for


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    670DF 00-08-A PDF