67-BALL BGA Search Results

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

PCB design for very fine pitch csp package

Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue

transistor CS4

Abstract: BGA Solder Ball 1mm D4047
Contextual Info: Issue 1.0 Sept 2001 Description The MSM64V256CB is a 16MBit Fast 3.3V SRAM available in a multichip 192 ball BGA Ball Grid Array package. The device can be organised as 256Kx64, 512Kx32 and 1Mx16. Access times of 15 and 20ns are available at Commercial or Industrial

Contextual Info: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature

Contextual Info: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature

Contextual Info: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.

Contextual Info: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

Contextual Info: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.

CY7C1461AV33

Abstract: CY7C1463AV33 CY7C1465AV33 K1061 u946 B897
Contextual Info: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.

Contextual Info: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero

203N

Abstract: FDZ203N
Contextual Info: FDZ203N N-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ203N minimizes both PCB space This BGA MOSFET embodies a

Contextual Info: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a

CY37032

Abstract: CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512
Contextual Info: Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes

CY7C1355C

Contextual Info: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero

Contextual Info: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero

BGA Solder Ball collapse

Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
Contextual Info: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to

CY7C1355B

Abstract: CY7C1357B 63a3
Contextual Info: CY7C1355B CY7C1357B 9-Mb 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles. • Can support up to 133-MHz bus operations with zero

CY7C1471V33-100AXI

Contextual Info: CY7C1471V33 CY7C1473V33 CY7C1475V33 PRELIMINARY 72-Mbit 2M x 36/4M x 18/1M x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.

Heraeus SOLDER PASTE F645

Abstract: heraeus f816 heraeus F645 SA30C5-89M30 Heraeus paste profile SN63-90 Heraeus paste profile F645 heraeus heraeus f816 SN63-90 Heraeus pb free paste profile
Contextual Info: SLVA333 Application Report May 2009 BGA Package Component Reliability After Long-Term Storage R. Key, B. Lange, R. Madsen ABSTRACT The white paper Component Reliability After Long Term Storage Texas Instruments application report SLVA304, http://focus.ti.com/lit/wp/slva304/slva304.pdf detailed a risk analysis with

spst reed relay

Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
Contextual Info: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic