64P6W Search Results

64P6W-B

Abstract: 64P6W
Contextual Info: 64P6W-B Plastic 64pin 14✕20mm body QFP EIAJ Package Code QFP64-P-1420-1.00 Weight g 1.25 JEDEC Code – Lead Material Alloy 42 MD ME 53 b2 64 e HD D 1 52 I2 19 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 33 20 32 A b y F A1 e c A2 L1

303A16

Abstract: transistor fp 1016 PA 0016 OOEA16 IH-001 212616 302616 6fd7 lg crt tv circuit diagram sm17
Contextual Info: MITSUBISHI MICROCOMPUTERS M37260M6-XXXSP/FP M37260E6-XXXSP/FP, M37260E6SP/FP SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER with ON-SCREEN DISPLAY CONTROLLER DESCRIPTION PIN CONFIGURATION TOP VIEW The M37260M6-XXXSP/FP is a single-chip microcomputer de­ signed with CMOS silicon gate technology- It is housed in a 52-pin

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

M50954

Abstract: M50954-XXXSP JB 2256 M50955 M50954XXXSP mitsubishi M507 m50754-xxxsp m50754 m50754xxxsp earom
Contextual Info: M ITS U B IS H I M IC R O C O M PU TER S M 5 0 7 5 4 - X X X S P /F P / G P ,M 5 0 9 5 4 - X X X S P /F P / GP, M 5 0 9 5 5 - X X X S P /F P /G P S IN G L E -C H IP 8 -B IT C M O S M IC R O C O M P U T E R DESCRIPTION The M50754-XXXSP, XXXSP are M50954-XXXSP

303A16

Abstract: 016XM FEF-16 jrmb 302616 FD616
Contextual Info: MITSUBISHI MICROCOMPUTERS M37260M6-XXXSP/FP M37260E6-XXXSP/FP, M37260E6SP/FP SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER with ON-SCREEN DISPLAY CONTROLLER DESCRIPTION The M37260M6-XXXSP/FP is a single-chip microcomputer de­ PIN CONFIGURATION TOP VIEW signed with CMOS silicon gate technology. It is housed in a 52-pin

ic59-64075-G4

Abstract: Yamaichi IC51-0804-808 IC51-1004-809 IC51-0644-807 IC51-0242-802 IC51-0644-807 Datasheet socket Yamaichi ic51 qfp IC51-0804-808 Yamaichi Electronics IC51-1004-814-6
Contextual Info: Appendix F List of MCU Connecting Parts Made by Partners Pin-pitch mm Package form Mounting socket SSOP 0.65 20P2E-A 20P2F-A - SOP 1.27 20P2N-A - SSOP 0.8 24P2Q-A - LQFP 0.8 32P6B-A 32P6U-A - SDIP 1.778 32P4B IC83-3204-GG4 (made by Yamaichi Electronics Co., Ltd.)

mitsubishi lot marking

Abstract: mitsubishi marking lot number all ic in one file
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: MITSUBISHI ICs TV M50571FP SYNC SIGNAL PROCESSING DESCRIPTION The M50571FP is a semiconductor integrated circuit for generating various sync signals and clock signals for EDTV system. A specially designed standard signal/non-standard signal detecting circuit also responds to non-standard signals. It

ic59-64075-G4

Abstract: IC51-0242-802 zigzag 40pin connector IC51-0844-401-1 M32R M32170T-SDI 100P6-B Eletech Electronics f 4556 M3888 QFP 128 lead .5mm
Contextual Info: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of

20MS

Abstract: 24P2W m66240
Contextual Info: •PERIPHERAL IC FOR MICROCOMPUTER AND MEMORY CONTINUED Functron 4 channel 16-bit PWM generator 4 channel 12-bit PWM generator High-drive, high-speed parallel I/O expander T yp elfo. i Package Outlire! Wal»Proœss M66240P/FP M66242P/FP M66500SP/FP Features

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

ic59-64075-G4

Abstract: IC51-0242-802 PC4600 ic59-64075 Eletech Electronics f 4556 IC51-0844-401-1 QFP 128 lead .5mm M32182 M32R
Contextual Info: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of

MELPS7700

Abstract: ad14 MELPS 7700 MELPS-7700 AD-12 M668 m377 AD12
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT ASSP M66800SP/FP DESCRIPTION PIN CONFIGURATION (TOP VIEW) The M66800SP/FP is a semiconducter integrated circuit containing memory controller for Mitsubishi single chip 16bit microcomputer MELPS7700 series (M33700S/SA etc.),

740-Family

Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
Contextual Info: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual

M5L8085

Abstract: mitsubishi M5L8085 M37700 M37450 M66500FP PA6 MITSUBISHI M66500SP M66500 M66S Ta-25t
Contextual Info: MITSUBISHI < DIGITAL ASSP> M 66500SP/FP PROGRAMMABLE BUFFERED I/O EXPANDER DESCRIPTION The M66500SP/FP is a large-scale integrated circuit chip for programmable high-speed I/O interface, manufactured using a Bi-CMOS process and is suitable for 8-and 16-bit

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension

Contextual Info: M IT S U B IS H I < DIGITAL A SS P> M 6 6 5 0 0 S P /F P PR O G R A M M A B LE B U F F E R E D I/O EXPANDER DESCRIPTION The M 66500SP /FP is a larg e-sca le inte grated c irc u it chip PIN CONFIGURATION TOP VIEW for program m able h ig h -s p e e d I/O interface, m anufactured