64C 1 Search Results

Contextual Info: QUAD FLAT TYPE MODULE 64 PIN CERAMIC MQP-64C-P01 64-pin ceramic MQFP Lead pitch 1.00mm Lead shape Straight Motherboard material Ceramic Mounted package material Plastic MQP-64C-P01 64-pin ceramic MQFP (MQP-64C-P01) 18.70(.736)TYP INDEX AREA 12.00(.472)TYP

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A02 Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal 64-pin ceramic QFP FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP

Contextual Info: QUAD FLAT TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index MQP-64C-P01 64-pin ceramic MQFP Lead pitch 1.00 mm Lead shape Straight Motherboard material Ceramic Mounted package material Plastic MQP-64C-P01

s-24c32c

Contextual Info: Rev.2.1_00_H S-24C32C/64C 2-WIRE SERIAL E2PROM The S-24C32C/64C is a 2-wire, low current consumption and wide range operation serial E2PROM. The S-24C32C/64C has the capacity of 32 K-bit and 64 K-bit, and the organization is 4096 words x 8-bit, 8192 words × 8-bit, respectively. Page write and sequential

Contextual Info: S-24C32C/64C 2-WIRE SERIAL E2PROM www.sii-ic.com Rev.4.0_01_H Seiko Instruments Inc., 2009-2013 The S-24C32C/64C is a 2-wire, low current consumption and wide range operation serial E2PROM. The S-24C32C/64C has the capacity of 32 K-bit and 64 K-bit, and the organization is 4096 words x 8-bit, 8192 words × 8-bit, respectively. Page write

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER 720-mil CERAMIC LEADLESS CHIP CARRIER LCC 24 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 720MIL
Contextual Info: LEADLESS CHIP CARRIER 64 PAD CERAMIC LCC-64C-A01 EIAJ code : ∗QFN064-C-S720-1 Lead pitch 40mil Package width x package length 720 × 720mil Sealing method Metal seal 64-pad ceramic LCC LCC-64C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.

Contextual Info: Datasheet M16C/64C Group RENESAS MCU 1. R01DS0016EJ0100 Rev.1.00 Feb 07, 2011 Overview 1.1 Features The M16C/64C Group microcomputer MCU incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address

PGA064-C-S10U-1

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index PGA-64C-A02 EIAJ code :∗PGA064-C-S10U-1 64-pin ceramic PGA Lead pitch 100 mil Pin matrix 10 Sealing method Metal seal PGA-64C-A02 64-pin ceramic PGA

SDIP064-C-0750-1

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index DIP-64C-A02 EIAJ code : SDIP064-C-0750-1 64-pin ceramic SH-DIP Lead pitch 70 mil Row spacing 750 mil Sealing method Metal seal DIP-64C-A02

ECX-64A

Contextual Info: ECX-64A/64C SMD QUARTZ CRYSTAL The ECX-64A and ECX-64C are subminiature SMD crystals with 3.5 X 6 mm footprint. The cost effective all ceramic package is available in 2 and 4 pad versions. The package height measures 1.1 mm max. which is ideal for densely populated PCB applications.

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index DIP-64C-A06 EIAJ code : SDIP064-C-0750-2 64-pin ceramic SH-DIP Lead pitch 70 mil Row spacing 750 mil Sealing method Metal seal DIP-64C-A06

WM-64K

Abstract: electret condenser mic electret mic panasonic WM-64KT WM-64Ct WM64K Panasonic Electret Condenser Microphone WM-64C electret mic PANASONIC WM
Contextual Info: Omnidirectional Back Electret Condenser Microphone Cartridge WM-64C／WM-64K ●Small and thin type omnidierectional microphone ●Solder type for leadwires ●Back electret type designed for high resistance to vibrations ●33pF or 10pF capacitor contained for RF noise reduction

BDV64

Abstract: philips BDV64A bdv64b transistor transistors BDV64B bdv64s BDV64B BDV65 BDV64 C
Contextual Info: f BDV64; 64A ; 64C PHILIPS INTERNATIONAL 5bE J> m 711002b 0G43342 3Tb • PHIN T - 3 3 -3 1 SILICON DARLINGTON POWER TRANSISTORS P-N-P epitaxial base transistors in monolithic Darlington circuit for audio output stages and general

Contextual Info: BDT64; 64A BDT64B; 64C _ / V SILICON DARLINGTON POWER TRANSISTORS PNP epitaxial base transistors in monolithic Darlington circuit for audio output stages and general purpose amplifier and switching applications. TO-220 plastic envelope. NPN complements are BDT65,

BDV64

Abstract: transistors BDV64B BDV64A BDV64C BDV64B BDV65, BDV64
Contextual Info: Inchange Semiconductor Product Specification BDV64/64A/64B/64C Silicon PNP Power Transistors DESCRIPTION •With TO-3PN package ·Complement to type BDV65/65A/65B/65C ·DARLINGTON ·High DC current gain APPLICATIONS ·For use in general purpose amplifier applications.

WM-61A

Abstract: wm-61b WM-64EK WM-62A transistor wm WM-54b WM-034B WM-52B wm-55d103 WM-60A
Contextual Info: Microphone Cartridges Schematic Diagram FET impedance converter ECM unit Capacitance C = 33 pF K = 10pF C Term 1 FET impedance converter Output RL capacitor Ground Shield case Standard Operating Conditions: Model No. Vs = 2.0V RL = 2.2kΩ WM-64C series WM-64K series

Y182

Abstract: transistor K 1413 bdv64 transistors BDV64B BDV64B
Contextual Info: i BDV64; 64A _ I l BDV64B; 64C PHILIPS INTERNATIONAL SbE D • 711DÖ2b 0D43342 3Tb ■ PHIN T - 3 3 -3 1 SILICON DARLINGTON POWER TRANSISTORS P-N-P epitaxial base transistors in monolithic Darlington circuit for audio output stages and general

BDV64

Abstract: transistors BDV64B BDV64B BDV64A BDV64C
Contextual Info: Inchange Semiconductor Product Specification BDV64/64A/64B/64C Silicon PNP Power Transistors DESCRIPTION ・With TO-3PN package ・Complement to type BDV65/65A/65B/65C ・DARLINGTON ・High DC current gain APPLICATIONS ・For use in general purpose amplifier

BDV65

Abstract: BDV65A BDV65B BDV65C
Contextual Info: Inchange Semiconductor Product Specification BDV65/65A/65B/65C Silicon NPN Power Transistors DESCRIPTION ・With TO-3PN package ・Complement to type BDV64/64A/64B/64C ・DARLINGTON ・High DC current gain APPLICATIONS ・For use in general purpose amplifier

BDV65

Abstract: BDV65C BDV65B BDV65A
Contextual Info: SavantIC Semiconductor Product Specification BDV65/65A/65B/65C Silicon NPN Power Transistors DESCRIPTION •With TO-3PN package ·Complement to type BDV64/64A/64B/64C ·DARLINGTON ·High DC current gain APPLICATIONS ·For use in general purpose amplifier applications.

transistors BDV64B

Abstract: BDV64 BDV64B BDV64A BDV64C BDV65, BDV64 64b diode
Contextual Info: SavantIC Semiconductor Product Specification BDV64/64A/64B/64C Silicon PNP Power Transistors DESCRIPTION •With TO-3PN package ·Complement to type BDV65/65A/65B/65C ·DARLINGTON ·High DC current gain APPLICATIONS ·For use in general purpose amplifier applications.

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC64 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 LCC-64C-A01 QFN064-C-S720-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC To Top / Package Lineup / Package Index LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal