64-PIN PLASTIC QFP 14X20 Search Results

QFP JEDEC tray

Abstract: QFP 14 14 tray qfp tray standard
Contextual Info: 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 4.82 6.35 19.6 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) Tray 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick)

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

64-PIN PLASTIC QFP

Abstract: B3332
Contextual Info: 64-PIN PLASTIC QFP STRAIGHT (14x20) A B 33 32 51 52 C D 20 19 64 1 F G H I M J P U T NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. K M ITEM MILLIMETERS A 24.4±0.4 B 20.0±0.2 C 14.0±0.2 D

64-PIN PLASTIC QFP

Contextual Info: 64-PIN PLASTIC QFP STRAIGHT (14x20) A B 51 52 33 32 C D 20 19 64 1 F G H I M J P U T NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. K M ITEM MILLIMETERS A 25.6±0.4 B 20.0±0.2 C 14.0±0.2 D

Contextual Info: 64 PIN PLASTIC QFP 14x20 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE Each lead centerline is located within 0.20 mm (0.008 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 23.6±0.4

64-PIN PLASTIC QFP 14x20

Contextual Info: 64-PIN PLASTIC QFP 14x20 A B detail of lead end 51 52 33 32 S C D R Q 64 1 20 19 F J G H I M P K N S S L M NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. ITEM A B C MILLIMETERS 23.2±0.2 20.0±0.2

64-PIN PLASTIC QFP

Contextual Info: 64-PIN PLASTIC QFP 14x20 A B 51 52 33 32 detail of lead end S C D 64 1 R 20 19 Q F G H I J M K P S N S NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. M L ITEM MILLIMETERS A B C 24.7±0.4 20.0±0.2

QFP JEDEC tray

Abstract: JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard
Contextual Info: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 × 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick)

0031h

Contextual Info: 80 PIN PLASTIC QFP 14x20 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE 1. Controlling dimension ITEM millimeter. 2. Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 80-PIN PLASTIC QFP 14x20 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G H I J M K P S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 24.0±0.4 B 20.0±0.2

Contextual Info: 80 PIN PLASTIC QFP 14x20 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 80-PIN PLASTIC QFP STRAIGHT (14x20) A B 41 40 64 65 C D 25 24 80 1 F G H I M J P U K M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 24.4±0.4 B 20.0±0.2 C D 14.0±0.2 18.4±0.4

Contextual Info: 80-PIN PLASTIC QFP 14x20 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G H I J M K P S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 24.7±0.4 B 20.0±0.2

Contextual Info: 80-PIN PLASTIC QFP 14x20 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G H I J M K P S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A B C 24.7±0.4 20.0±0.2

Contextual Info: 80 PIN PLASTIC QFP 14x20 A B 41 40 64 65 F Q 3°+7° –3° S D C detail of lead end 25 24 80 1 G H I M J M P K N L P80G-80-1C-2 NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: 80 PIN PLASTIC QFP 14x20 A B F Q 5°±5° 25 24 S 80 1 detail of lead end D 41 40 C 64 65 G H I M J Q M P K N L S80G-80-02-2 NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition. ITEM

UPD70208H

Abstract: TQFP 14X20
Contextual Info: NEC //PD70208H, 70216H 17. PACKAGE DRAWINGS 80 PIN PLASTIC QFP 14x20 64 |65 ill I 41 40 detail of lead end 80 ' 1 H Ifr l I I n ra n P80GF-80-3B9-2 INCHES A 23.6±0.4 0 .9 2 9 *0 .0 1 6 B 2 0 .0 *0 .2 0.795toooi C 14 .0*0 .2 D 17 .6*0 .4 0 .6 9 3 *0 .0 1 6

Contextual Info: NEC 12. ltP D 7 5 3 1 2 A , 7 5 3 1 6 (A ) P A C K A G E D R A W IN G S 80 PIN PLASTIC QFP (14x20) 41 40 64 65 detail of lead end Q a o 25 24 o N P80G F-80-3 B9-2 NOTE Each lead centerline is located w ith in 0.15 mm (0.006 inch) of its true position (T.P.) at

Contextual Info: ASIC # Standard Cells Package List Numerical value in the list means pin count. QFP, QFH, TQFP, LQFP Type Dimension (unit) Package \ Pin pitch (mm) (mm Xm m ) 7d 40,44 1.51,2.0t 0.8 Q FP'2 10D 0.65 12° 14a 14X20 18° QFH*2 64 2.0t 84 2.5t 64 2.0t 80 2.0t

CERAMIC LEADLESS CHIP CARRIER LCC 124

Contextual Info: INTL. M I C R O C I R C U I T S INC MÔE D MflSGMlfl OGDOSMfl fl4b • I f I T IMIK3000 FAMILY 1.0 Micron CMOS GATE ARRA YS T- V2 -IÌ-D 1 '•*{ r, In t e r n a t io n a l M icro cir cuit s Inc PRELIMINARY PRODUCT FEATURES March 1991 PRODUCT DESCRIPTION The IMIK3000 family of gate arrays from International

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

IEM-902

Abstract: uPD74HCU04 254 nm uv LED 75108cw uPD75P108BGF-3BE NEC uPD751 75p116gf marking code P73 75P108 uPD75108
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD75P108B 4-BIT SINGLE-CHIP MICROCOMPUTER DESCRIPTION The µPD75P108B is a version of the µPD75108 in which the on-chip mask ROM is replaced by one-time PROM which can be written to once only, or EPROM which is capable of program write, erasure and rewrite.

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America