| 10131319-02121G0LF |  | Amphenol Communications Solutions | Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible Nylon66, Tray Packing. | PDF |  | 
| 69190-216HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 16  Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 69190-214HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 14  Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 69190-212HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 12  Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 10127819-02521LF |  | Amphenol Communications Solutions | Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing. | PDF |  |