56GQL Search Results

56GQL Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
UA42 Abstract: VFBGA-48 bga rework aa56 yamaichi socket Contextual Info: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm	Original	56gql 56-pin 65-mm scet004 +5ua42 vfbga-48 bga rework aa56 yamaichi socket	PDF
jesd 51-7 Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000 Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs	Original	szza040 54bga 54-ball mo-205 +916-bit jesd 51-7 63 ball vfbga thermal resistance 56dl metcal apr 5000 56zql bga ball crack 054ug08c127 apr-5000	PDF

Catalog Datasheet

Type

Document Tags

PDF

UA42

Abstract: VFBGA-48 bga rework aa56 yamaichi socket
Contextual Info: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm

Original

56gql 56-pin 65-mm scet004 +5

PDF

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

Original

szza040 54bga 54-ball mo-205 +9

PDF