554423FL Search Results
554423FL Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
MIL-C-28859Contextual Info: HIGH DENSITY PLUS Daughtercard Modules Socket modules are pre-assembled into precisely located holes in an extruded aluminum stiffener. End-stackability offers the same flexibility to the daughtercard assembly as the backpanel modules. Both are available in |
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554423fl 000213S MIL-C-28859 | |
S544BContextual Info: HIGH DENSITY PLUS HP Series Backpanel Pin Module plug-up capability to standard socket connectors. Plus rows of contacts in the pin modules are located within the side walls of the insulator. They employ a preloaded cantilever spring design similar to those found in cardedge connectors. |
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554423fl S544B |