XPN1300ANC
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF) |
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54122-107641300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch |
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54122-108081300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch |
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54122-108141300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch |
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54122-819321300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch |
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54122-807161300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch |
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