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68653-408HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail. |
PDF
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86093247313750NMLF
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Amphenol Communications Solutions
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DIN Headers & receptacles, Backplane Connectors, DIN Standard Header, Solder-to-Board, Style C/2, 48 Position, Class I. |
PDF
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TLV2473IN
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Texas Instruments
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Dual Low-Power Rail-to-Rail Input/Output Op Amp w/Shutdown 14-PDIP -40 to 125 |
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BQ24735RGRR
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Texas Instruments
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1-4 Cell Li+ Battery SMBus Charge Controller for Supporting Turbo Boost Mode 20-VQFN -40 to 85 |
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TLV2473CDR
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Texas Instruments
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Dual Low-Power Rail-to-Rail Input/Output Op Amp w/Shutdown 14-SOIC 0 to 70 |
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