|
TPD2017FN
|
|
Toshiba Electronic Devices & Storage Corporation
|
Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 |
Datasheet
|
|
|
54242-108201750LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
75844-201-72LF
|
|
Amphenol Communications Solutions
|
BERGSTIK |
PDF
|
|
|
54122-110201700LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
59202-F40-20-174LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions. |
PDF
|
|
