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    50 MIL PITCH CERAMIC PACKAGE Search Results

    50 MIL PITCH CERAMIC PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ101KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KB4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ102MN4A
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ472MA4B
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KA4BE01J
    		Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF

    50 MIL PITCH CERAMIC PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095)


    Original     		FPT-16C-C02 16-pin FPT-16C-C02) F16016SC-1-2 PDF

    Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02)


    Original     		FPT-16C-C02 16-pin FPT-16C-C02) F16016SC-1-2 PDF

    Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN CERAMIC LCC-26C-A01 26-pin ceramic SOJ Lead pitch 50 mil Package width 316 mil Sealing method Metal seal Lead shape J bend LCC-26C-A01 26-pin ceramic SOJ (LCC-26C-A01) 3.55 (.140) MAX


    Original     		LCC-26C-A01 26-pin LCC-26C-A01) C26004SC-3-2 PDF

    QFJ-44C-C01

    Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)


    Original     		QFJ-44C-C01 44-pin QFJ-44C-C01) J44001SC-4-2 QFJ-44C-C01 PDF

    QFJ-32C-C01

    Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)


    Original     		QFJ-32C-C01 32-pin QFJ-32C-C01) J32001SC-3-2 QFJ-32C-C01 PDF

    26-pin

    Abstract: SOJ 24
    Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN CERAMIC To Top / Package Lineup / Package Index LCC-26C-A01 26-pin ceramic SOJ Lead pitch 50 mil Package width 316 mil Sealing method Metal seal Lead shape J bend LCC-26C-A01 26-pin ceramic SOJ


    Original     		LCC-26C-A01 26-pin LCC-26C-A01) C26004SC-3-2 SOJ 24 PDF

    LCC28

    Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ


    Original     		LCC-28C-A04 28-pin LCC-28C-A04) C28011SC-2-2 LCC28 PDF

    Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010)


    Original     		LCC-28C-A04 28-pin LCC-28C-A04) C28011SC-2-2 Customer18 PDF

    36 pin CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)


    Original     		LCC-36C-F01 WQFN036-G-S550-1 36-pad LCC-36C-F01) C36001SC-1-2 36 pin CERAMIC LEADLESS CHIP CARRIER LCC transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600 PDF

    WQFN032-C-R450-1

    Abstract: C038
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)


    Original     		LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 WQFN032-C-R450-1 C038 PDF

    WQFN032-G-R450-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)


    Original     		LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15TYP WQFN032-G-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32 PDF

    QFN016-G-S250-1

    Abstract: LCC-16C-F01 R030
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)


    Original     		LCC-16C-F01 QFN016-G-S250-1 16-pad LCC-16C-F01) C16003S4 C16003SC-2-2 QFN016-G-S250-1 LCC-16C-F01 R030 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC 44 WQFN044-G-S650-1 LCC44 PDF

    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index FPT-32C-C02 32-pin ceramic QFP Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape Gullwing Sealing method Cerdip Length of flat


    Original     		FPT-32C-C02 32-pin FPT-32C-C02) F32012SC-3-2 PDF

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC To Top / Package Lineup / Package Index LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal


    Original     		LCC-16C-F01 QFN016-G-S250-1 16-pad LCC-16C-F01) C16003SC-2-2 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC 16 Pin Package CERAMIC LEADLESS CHIP CARRIER PDF

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal


    Original     		LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15T010 15TYP PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal


    Original     		LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
    Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal


    Original     		LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44 PDF

    Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01


    Original     		QFJ-32C-C01 32-pin QFJ-32C-C01) J32001 J32001SC-3-2 PDF

    Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01


    Original     		QFJ-44C-C01 44-pin QFJ-44C-C01) J44001SC-4-2 PDF

    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC FPT-32C-C02 32-pin ceramic QFP Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm FPT-32C-C02


    Original     		FPT-32C-C02 32-pin FPT-32C-C02) F32012SC-3-2 PDF

    FPT-16C-C01

    Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 0.125±0.025 (.005±.005) +.020


    Original     		FPT-16C-C01 16-pin FPT-16C-C01) F16006SC-4-2 FPT-16C-C01 PDF

    Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-F01 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05


    Original     		FPT-28C-F01 28-pin FPT-28C-F01) F28009SC-2-2 aC-F01) PDF

    Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index FPT-24C-F01 24-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX


    Original     		FPT-24C-F01 24-pin FPT-24C-F01) F24002SC-2-2 PDF