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67998-156HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
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10114492-008LF
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Amphenol Communications Solutions
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HPCE R/A REC 32P24S |
PDF
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68449-220HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
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10132449-2021GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 20 Positions, GW Compatible PA9T, Tray packing. |
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10132449-2411GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 24 Positions, GW Compatible PA9T, Tray packing. |
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