49X49 Search Results

16X16

Abstract: bga 576 socket bga 24x24 576
Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00

thermal conductive pressure sensitive adhesive

Abstract: adhesive 8815 k WU-M-392 Vossloh-Schwabe
Contextual Info: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices

x1011

Abstract: 19X19 34x34 X101-1
Contextual Info: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 LED-Module Detaillierte Informationen und Anwendungsrichtlinien finden Sie auf dem 3M oder Bergquist Datenblatt für wärmeleitende Transferklebebänder 8805; 8810;

650NM photodiode

Abstract: 650nm 940NM PD-0066 photodiode 940nm
Contextual Info: SILICON PHOTODIODE CHIPS DEVICE NO. : PD-0066 1. Scope : This specification applies to PIN silicon photodiode chips, Device No. PD-0066 2. Structure : 2-1. Planar type : PIN diode. 2-2. Electrodes : Top side Anode : Aluminum alloy . Back side ( Cathode ) : Gold alloy.

F100163

Contextual Info: Ggl National Æm Semiconductor F100183 2 x 8-Bit Recode Multiplier General Description F100183 perform s parallel m ultiplication o f tw o signed num ­ bers in tw os com ple m e nt form to produce a signed tw os com plem ent product. All inputs have 50 k ft pull-dow n resis­

F100179

Abstract: F100180 F100182 F100183 987510 5 bit binary multiplier using adders
Contextual Info: E g National æ ü Semiconductor F100183 2 x 8-Bit Recode Multiplier General Description The F100183 is a 2 x 8 -bit recode multiplier designed to perform high-speed hardware multiplication. In conjunction with the F100182 Wallace Tree Adder, the F100179 Carry

WU-M-294

Abstract: 8810 WU-M-291 WU-M-292
Contextual Info: Wärmeleitende Transferklebebänder für High Performance Module TM 3M Typ 8810 Wärmeleitende Transferklebebänder wurden dazu entwickelt, einen bevorzugten Wärmeübertragungsweg zwischen wärmeerzeugenden Bauteilen und Kühlkörpern oder anderen Kühlbaugruppen z. B. Heat Spreader zu schaffen.

wallace tree multiplier

Abstract: PC30 Bi 3101 A M 3101 KB 100180
Contextual Info: 100183 NATIONAL SEPIICOND LOGIC bSDUES blE D National Semiconductor 007bD05 ^OS « N S C l N o t In ten d ed For N ew Designs T - V 0 7 f - 100183 2 x 8-Bit Recode Multiplier General Description T he 100183 is a 2 x 8 -bit recode m ultiplier designed to per­

RFSA-61B

Abstract: RFSA-11B AC124 KU-68
Contextual Info: RF приёмник: Включатель RFSA-11B, RFSA-61B ! ! ! ! ! ! ! RFSA-11B Технические параметры Напряжение питания: Мощность: Допуск напряжения питания: Выход Кол-во контактов:

Contextual Info: £3 National Æm Semiconductor Not Intended For New Designs 100183 2 x 8-Bit Recode Multiplier General Description The 100183 is a 2 x 8 -bit recode multiplier designed to per­ form high-speed hardware multiplication. In conjunction with the 100182 Wallace Tree Adder, the 100179 Carry Look­

710018

Abstract: ae gp 735 wallace tree 5 bit binary multiplier using adders ay 5 1011 FBTAL Bi 3101 A
Contextual Info: LOGIC blE J> 100183 NATIONAL SEMICOND 3-90 • bSQUSE G 0 7 b 0 G 5 ÌOS « N S C l NATIONAL SEMICOND E a k_ O) <0 Q '5 > o o a> 3 _ 1- ° + + + TC\l CM I I HIGH Voltage Level LOW Voltage Level (LOGIC) blE î ■ b5Q1122 007b00b B41 «NSC1 100183 lu. i-

X1011

Abstract: Vossloh-Schwabe 19X19
Contextual Info: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling devices

250VA

Contextual Info: RF приёмник: Регулятор освещения RFDA-11B, RFDA-71B радиоуправляемый регулятор освещения предназначенный для создания световых сцен, управление одним или группой светильников

650NM photodiode

Abstract: 3066 650nm 880nm 940nm 880nm photodiode 940nm
Contextual Info: SILICON PHOTODIODE CHIPS DEVICE NO. : PD-3066 1. Scope : This specification applies to PIN silicon photodiode chips, Device No. PD-3066 2. Structure : 2-1. Planar type : PIN diode. 2-2. Electrodes : Top side Anode : Aluminum alloy . Back side ( Cathode ) : Gold alloy.

thermal conductive pressure sensitive adhesive

Abstract: 320x35
Contextual Info: Thermally Conductive Adhesive Transfer Tapes for LED Modules TM 3M Type 8810 and Bergquist Bond-Ply 100 Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heattransfer path between heat-generating components and heat-sinks or other cooling

8815 k

Abstract: 8810 WU-M-392 WU-M vossloh
Contextual Info: Wärmeleitende Transferklebebänder für LED-Module TM 3M Typ 8810 und Bergquist Bond-Ply 100 Durch die weiche Oberflächenbeschaffenheit können sich die Klebefolien auch unebenen Substraten anpassen und bieten eine große Klebkraft und Wärmekopplung. Die besondere