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86094641113765E1LF
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Amphenol Communications Solutions
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DIN Right Angle Header Solder-to-Board Style C64 ways, Class I |
PDF
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68464-110HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68464-118HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68464-116HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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67292-009
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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