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ST1000GXH35
|
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Toshiba Electronic Devices & Storage Corporation
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IEGT, 4500 V, 1000 A, 2-120B1S |
Datasheet
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92634-456HLF
|
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail. |
PDF
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68464-456HLF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10144569-002LF
|
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Amphenol Communications Solutions
|
Hermetic Connector Series, 6Pin, Glass Sealed. |
PDF
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54101-T10-06LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch. |
PDF
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