|
ST1000GXH35
|
|
Toshiba Electronic Devices & Storage Corporation
|
IEGT, 4500 V, 1000 A, 2-120B1S |
Datasheet
|
|
|
75844-379-26LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
75844-379-10LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
75844-379-12LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54101-T10-06LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch. |
PDF
|
|
