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DNR2 Abstract: GE SG80 S1 Contextual Info: @ LG Semicon. Co. LTD. Description Features The GMM7321010ES/SG is an lM x 32 bits D y n a m ic R A M M O D U L E w h ic h is assem bled 8 pieces o f 1M x 4bit EDO DRAMs in 20/26 pin SOJ package on single sides the printed circuit board with decoupling capacitors. The G M M 7321010ES/SG is	OCR Scan	GMM7321010ES/SG 7321010ES/SG GMM7321010ES/SG GMM7321010ES GMM732101OESG 40BB757 DNR2 GE SG80 S1	PDF

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Abstract: GE SG80 S1
Contextual Info: @ LG Semicon. Co. LTD. Description Features The GMM7321010ES/SG is an lM x 32 bits D y n a m ic R A M M O D U L E w h ic h is assem bled 8 pieces o f 1M x 4bit EDO DRAMs in 20/26 pin SOJ package on single sides the printed circuit board with decoupling capacitors. The G M M 7321010ES/SG is

OCR Scan

GMM7321010ES/SG 7321010ES/SG GMM7321010ES/SG GMM7321010ES GMM732101OESG 40BB757 DNR2 GE SG80 S1

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